TiO2@Ag/P (VDF-HFP) composite with enhanced dielectric permittivity and rather low dielectric loss
TiO2@Ag/P (VDF-HFP) composite with enhanced dielectric permittivity and rather low dielectric loss
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DOI：
10.1039/c6ra08259a
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发表时间：
2016-07
期刊：
影响因子：
3.9
通讯作者：
X. Xiao;N. Xu;Yongchang Jiang;Qilong Zhang;Enjie Yu;Hui Yang
中科院分区：
文献类型：
--
作者：
X. Xiao;N. Xu;Yongchang Jiang;Qilong Zhang;Enjie Yu;Hui Yang
采用乙二醇还原法合成了负载Ag的TiO2杂化粒子(TiO2@Ag)作为填料。在此基础上，通过将TiO2纳米粒子嵌入聚偏二氟乙烯-六氟丙烯共聚物[P(VDF-HFP)]基质中制备了TiO2@Ag/P(VDF-HFP)杂化薄膜。形貌和热分析表明，TiO2@Ag的引入不会破坏聚合物基体的连续性，而填料与基体之间的强相互作用影响了复合材料的结晶过程。 Ag与TiO2的粘附有效地分离了Ag颗粒的连接并抑制了导电网络的形成，并且超小的Ag纳米颗粒由于库仑封锁和量子限制效应“捕获”了载流子，从而导致复合材料具有低介电损耗和导电率。因此，当填料含量为 30 vol% 时，聚合物纳米复合材料的介电常数比 P(VDF-HFP) 基体提高了 300%，同时保持相当低的介电损耗（1 kHz 时为 0.037），展示了在电子设备中的有前景的应用。
Ag-loaded TiO2 hybrid particles (TiO2@Ag) were synthesized as fillers by using an ethylene glycol reduction method. Based on this, the TiO2@Ag/P(VDF-HFP) hybrid films were prepared by embedding TiO2 nanoparticles in a poly(vinylidene fluoride-co-hexafluoropropylene) [P(VDF-HFP)] matrix. Morphology and thermal analysis show that the introduction of TiO2@Ag does not disrupt the continuity of the polymer matrix, while the strong interaction between fillers and matrix influences the crystallization process of the composite. The adhesion of Ag to TiO2 efficiently separates the Ag particles from connecting and suppresses the formation of a conductive network, and the ultra-small Ag nanoparticles “trap” the carriers due to coulombic blockade and quantum confinement effect, which results in low dielectric loss and electrical conductivity of the composites. As a consequence, the dielectric permittivity of polymer nanocomposites was enhanced by 300% over the P(VDF-HFP) matrix at a filler content of 30 vol% while maintaining a rather low dielectric loss (0.037 at 1 kHz), demonstrating promising applications in electronic devices.