Molecular dynamics study of scratching velocity dependency in AFM-based nanometric scratching process
Molecular dynamics study of scratching velocity dependency in AFM-based nanometric scratching process
复制标题
基于 AFM 的纳米划痕过程中划痕速度依赖性的分子动力学研究
DOI：
10.1016/j.msea.2008.10.049
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发表时间：
2009-04
期刊：
影响因子：
--
通讯作者：
Junjie Zhang, Tao Sun,Yongda Yan,Yingchun Liang
中科院分区：
文献类型：
--
作者：
Junjie Zhang, Tao Sun,Yongda Yan,Yingchun Liang
采用三维分子动力学模拟研究了基于原子力显微镜的单晶铜纳米刻划过程。研究了刻划速度（1、10和100m/s）对切屑图案、刻划阻力、位错运动和工件变形的影响。结果表明，随着刮擦速度的增加，刮擦阻力增大。刮擦速度越快，切屑体积越大，切屑形状越接近，非晶结构越明显。在低速（1和10m/s）下，位错的移动比在高速（100m/s）下更有规律。刀具边缘下工件材料变形区面积随切削速度的增加而减小。
Three-dimensional molecular dynamics simulations are performed to investigate the AFM-based nanometric scratching process of monocrystalline copper. The effects of scratching velocities (1, 10, and 100m/s) on the chip pattern, scratching resistance, dislocation movement, and workpiece deformation are studied. The results show that the scratching resistance increases with the increase in scratching velocity. The higher scratching velocity results in larger chip volume and closer chip shape with more amorphous structure. The dislocations move well-regulated for lower velocities (1 and 10m/s) than that for larger one (100m/s). The area of workpiece material deformation region beneath the tool edge decreases with the increase in scratching velocity.
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影响因子：
3.7
作者：
FOILES, SM;BASKES, MI;DAW, MS
通讯作者：
DAW, MS
DOI：
10.1243/095440604774202213
发表时间：
2004-06
期刊：
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
影响因子：
--
作者：
H. Tanaka;S. Shimada;N. Ikawa
通讯作者：
H. Tanaka;S. Shimada;N. Ikawa
影响因子：
8.6
作者：
DAW, MS;BASKES, MI
通讯作者：
BASKES, MI
影响因子：
4.1
作者：
PLIMPTON, S
通讯作者：
PLIMPTON, S
影响因子：
3.7
作者：
Kelchner, CL;Plimpton, SJ;Hamilton, JC
通讯作者：
Hamilton, JC