Ions released from dental amalgams in contact with titanium
Ions released from dental amalgams in contact with titanium
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DOI：
10.4012/dmj.22.96
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发表时间：
2003-03-01
影响因子：
2.5
通讯作者：
Okuno, O
中科院分区：
文献类型：
--
作者：
Lim, SD;Takada, Y;Okuno, O
在37℃的0.9% NaCl溶液中，当钛/银汞合金的表面积比分别为1/10、1/1和10/1时，定量分析了常规银汞合金和高铜银汞合金与钛接触时释放的离子。在相同的条件下，测定了汞合金和钛的腐蚀电位。利用扫描电镜和WDS对合金进行了表面分析。常规汞合金的电势始终低于钛合金，而高铜汞合金的电势在浸没初期发生逆转，一直低于钛合金。当钛的表面积比为10/1时，与未接触钛的汞齐相比，常规汞齐和高铜汞齐释放的锡离子和铜离子均显著增加。在如此大的钛表面积上的电偶腐蚀可能导致银汞合金的严重腐蚀。
The ions released from conventional and high-copper amalgams in contact with titanium were quantitatively analyzed in a 0.9% NaCl solution at 37degreesC when the surface area ratio of titanium/amalgam was set up as 1/10, 1/1, or 10/1. The corrosion potentials of the amalgams and titanium were measured under the same conditions. Surface analyses on the amalgams were also employed using SEM with WDS. Though the potential of the conventional amalgam was always lower than that of titanium, that of the high-copper amalgam was reversed during the early stage of immersion and remained lower. When the surface area ratio of titanium grew at 10/1, tin and copper ions released from the conventional and high-copper amalgam, respectively, increased significantly compared with those of each amalgam that was not in contact with titanium. The galvanic corrosion in such a large surface area of titanium possibly led to the heavy corrosion of the amalgams.