HiFlow3: A Hardware-Aware Parallel Finite Element Package
HiFlow3: A Hardware-Aware Parallel Finite Element Package
复制标题
HiFlow3：硬件感知并行有限元包
DOI：
10.1007/978-3-642-31476-6_12
复制
发表时间：
2011
期刊：
影响因子：
--
通讯作者：
Martin Wlotzka
中科院分区：
文献类型：
--
作者：
H. Anzt;W. Augustin;Martin Baumann;T. Gengenbach;Tobias Hahn;Andreas Helfrich;V. Heuveline;E. Ketelaer;D. Lukarski;A. Nestler;S. Ritterbusch;Staffan Ronnås;M. Schick;Mareike Schmidtobreick;C. Subramanian;Jan;Florian Wilhelm;Martin Wlotzka
本文的目的是描述硬件感知的并行C++有限元程序包HiFlow3。HiFlow3旨在为模拟由偏微分方程建模的过程提供一个强大的平台。我们的愿景是通过将数值模拟与现代软件设计和最先进的硬件技术相结合，以适当的方式解决边值问题。将数学模型映射到并行软件的主要功能在三个核心模块网格、DOF/FE和线性代数(LA)中实现。并行是在两个层面上实现的。这些模块提供高效的基于MPI的分布式数据结构，以在大型HPC系统上实现性能，也在独立工作站上实现性能。此外，LA模块中的硬件感知跨平台方法通过利用多核CPU和GPU等新兴技术的计算能力加快了解决过程。在此背景下，将演示对不同硬件体系结构的性能评估。
The goal of this paper is to describe the hardware-aware parallel C++ finite element package HiFlow3. HiFlow3 aims at providing a powerful platform for simulating processes modelled by partial differential equations. Our vision is to solve boundary value problems in an appropriate way by coupling numerical simulations with modern software design and state-of-the-art hardware technologies. The main functionalities for mapping the mathematical model into parallel software are implemented in the three core modules Mesh, DoF/FEM and Linear Algebra (LA). Parallelism is realized on two levels. The modules provide efficient MPI-based distributed data structures to achieve performance on large HPC systems but also on stand-alone workstations. Additionally, the hardware-aware cross-platform approach in the LA module accelerates the solution process by exploiting the computing power from emerging technologies like multi-core CPUs and GPUs. In this context performance evaluation on different hardware-architectures will be demonstrated.