High-Resolution Piezo Inkjet Printhead Fabricated by Three Dimensional Electrical Connection Method using through Glass VIA
High-Resolution Piezo Inkjet Printhead Fabricated by Three Dimensional Electrical Connection Method using through Glass VIA
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使用玻璃 VIA 通过三维电连接方法制造的高分辨率压电喷墨打印头
DOI：
10.1109/memsys.2009.4805430
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
N. Morita
中科院分区：
文献类型：
--
作者：
M. Murata;T. Kondoh;T. Yagi;N. Funatsu;K. Tanaka;H. Tsukuni;K. Ohno;H. Usami;R. Nayve;N. Inoue;S. Seto;N. Morita
研制了每英寸1200个喷嘴的高分辨率压电式喷墨打印头。通过研磨法平整的聚酰亚胺薄膜，将压电致动器(PAS)放置在矩阵阵列(32×16)中，将带有通孔的玻璃基板连接到硅基板上。由溅射沉积的PZT(PZT)薄膜和硅膜片组成的薄PA有助于缩小PA的尺寸，进而实现高密度集成。通孔表面电镀镍，采用抗蚀剂喷涂和湿法腐蚀形成钛铜互连线。玻璃基板还充当封装板以在PA上形成空腔空间，这使得PA能够进行所需的位移。PIJ打印头通过单次喷射驱动成功喷射2PL墨滴，通过三次多次喷射驱动成功喷射8PL墨滴。
High-resolution piezo inkjet (PIJ) printhead with 1200 nozzles per inch (npi) has been developed. A glass substrate with through holes is bonded to Si substrate with piezo actuators (PAs) placed in matrix array (32 × 16) via polyimide film planarized by grinding method. A thin PA composed of sputter-deposited Pb(Zr, Ti)O3 (PZT) film and Si diaphragm contributes to a shrink of PA size and then high dense integration. The through holes are electroplated with Ni, and Ti/Cu interconnect is formed by resist spray coating and wet etching method. The glass substrate also acts as an encapsulation plate to form a cavity space over the PA, which enables a desirable displacement of the PA. The PIJ printhead exhibited a successful ejection of 2pl ink drops by single jetting drive and 8pl ink drops by three multiple jetting drive.