Investigation of concurrent multiscale topology optimization for designing lightweight macrostructure with high thermal conductivity
Investigation of concurrent multiscale topology optimization for designing lightweight macrostructure with high thermal conductivity
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DOI：
10.1016/j.ijthermalsci.2022.107653
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发表时间：
2022
影响因子：
4.5
通讯作者：
Musaddiq Al Ali;M. Shimoda
中科院分区：
文献类型：
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作者：
Musaddiq Al Ali;M. Shimoda
轻质高导热固体结构在工程的各个领域都发挥着重要的作用。为了最大限度地提高这种结构的设计性能，我们研究了多尺度的拓扑优化过轻的导热多孔结构，并介绍了一个数学优化模型配方，同时优化的结构（宏观结构）和本构孔（微观结构）。微尺度被认为是一个有代表性的体积单元，并使用渐近均匀化方法设计。对于每次迭代，在优化过程中评估微观结构的有效导热系数张量，并将其用作宏观结构的导热系数。对该并行优化方案进行了灵敏度分析，以解决宏观和微观耦合问题。为了拓宽研究的适用范围，本文提出了三种拓扑优化方法，研究了SIMP、水平集和ESO算法，并对结果进行了比较和讨论。该方法成功地应用了并行多尺度优化方法，并在宏观尺度和微观尺度上实现了良好的耦合。此外，配方表现出强烈的影响之间的宏观和微观尺度的拓扑优化方法的设计问题。通过在宏观设计领域引入各种微结构来增加设计自由度，显示出与实现高重量减轻相关的上级性能。此外，并行优化方案，使微结构获得良好的空间布局的材料，同时考虑到重量减轻的约束。所设计的微结构的空间布置实现了在朝向宏观结构设计的热传导区的较短路径中传导热。这允许在高重量减轻的情况下获得良好的性能。通过不同网格数的算例，研究了多尺度拓扑优化的网格依赖性。通过纳入3D案例研究，扩大了研究范围。采用等值面技术实现高细节模型，以最少的网格数实现高细节并行优化设计，以减少计算量。对3D优化情况进行了实验研究。
Lightweight and high heat conductive solid structures are playing important role in various fields of engineering. To maximize the design performance for such structures, we investigated multiscale topology optimization for excessive lightweight heat-conductive porous structures and introduced a mathematical optimization model formulation for concurrently optimizing the structures (macrostructure) and the constitutive pores (microstructure). The microscale is considered a representative volume element and designed using the asymptotic homogenization method. For each iteration, the effective heat conductivity tensor of the microstructure is evaluated during the optimization process and used as the heat conductivity of the macrostructure. Sensitivity analysis on this concurrent optimization scheme was derived to address the macro and microstructure coupling. To broaden the scope of the research applicability, three topology optimization methods, i.e., SIMP, level set and ESO are investigated, and the results are compared and discussed. The suggested formulations showed a successful application of the concurrent multiscale optimization formulations and good coupling on the macro and microscale. Also, the formulations demonstrated a strong influence between the macro and the microscale of the design problem for the topology optimization methods. Increasing the design freedom by introducing various microstructures for the macro design domain showed superior performance associated with attaining high weight reduction. In addition, the concurrent optimization scheme has enabled the microstructures to attain a good spatial layout of materials while taking into account the weight reduction constraint. The spatial arrangements of the designed microstructures have achieved conducting heat in a shorter path toward the heatsink zone of macrostructure design. This allows attaining good performance with high weight reduction. Furthermore, numerical examples of different mesh numbers were used to study mesh dependency of multiscale topology optimization. The scope of the study was broadened by the inclusion of 3D case studies. Implementing Isosurface technique to achieve high detail model was also used to attain high detailed concurrently optimized design with minimal mesh number to minimize the computational cost. The 3D optimized case was investigated experimentally.