Metal printing with modified polymer bonding lithography
Metal printing with modified polymer bonding lithography
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DOI:
10.1063/1.2218818
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发表时间:
2006-06
影响因子:
4
通讯作者:
Xinhong Yu;Shunyang Yu;Zhe Wang;D. Ma;Yanchun Han
中科院分区:
文献类型:
--
作者:
Xinhong Yu;Shunyang Yu;Zhe Wang;D. Ma;Yanchun Han
A simple and versatile metal thin film patterning method is introduced, using the adhesion between polymer and metal thin film as the driving force. Solvent vapor treatment is used to increase the adhesive ability between polymer and metal film in two reverse processes. After selective transfer printing, metal patterns on polymer film or flat elastomeric stamp can be fabricated. Multilayer metal patterns can also be fabricated with this method through multiple printing. Finally, this method was used to fabricate polymer field-effect transistors. The discussions on the effects of solvent on the transistor performance have been given.