Direct-immersion cooling for high power electronic chips
Direct-immersion cooling for high power electronic chips
复制标题
高功率电子芯片的直接浸入式冷却
DOI：
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发表时间：
1992
期刊：
影响因子：
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通讯作者：
I. Mudawar
中科院分区：
文献类型：
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作者：
I. Mudawar
几个直接浸入式冷却技术目前正在审查。它们包括通过池沸腾、降膜、槽流沸腾和射流冲击冷却。两个热性能和实际封装的问题进行了讨论，并从隔离芯片和多芯片模块的散热高的热通量的每种技术的适用性进行评估，相对于芯片结温，冷却均匀性，和临界热通量（CHF）等考虑因素。结果表明，有几种方法可以大大提高CHF，以满足未来电子设备的冷却要求。虽然高冷却通量是可能的一些直接浸入式冷却技术，冷却剂调节和输送到芯片的复杂性，应仔细考虑在选择合适的冷却技术。<<ETX>>
Several direct-immersion cooling techniques currently under examination are reviewed. They include cooling by means of pool boiling, falling films, channel flow boiling, and jet impingement. Both thermal performance and practical packaging concerns are discussed, and the suitability of each technique for dissipating high heat fluxes from isolated chips and multichip modules is assessed with respect to such considerations as chip junction temperature, cooling uniformity, and critical heat flux (CHF). It is shown that several means are available for greatly increasing CHF in order to satisfy the cooling requirements for future electronic devices. While high cooling fluxes are possible with a number of direct-immersion cooling techniques, the complexity of the coolant conditioning and delivery to the chips should be carefully considered in selecting a suitable cooling technique.<<ETX>>