Solving EM Scattering From Complex Thin Dielectric/PEC Composite Targets by a VSIE-Based Method
Solving EM Scattering From Complex Thin Dielectric/PEC Composite Targets by a VSIE-Based Method
复制标题
通过基于 VSIE 的方法解决复杂薄电介质/PEC 复合目标的电磁散射问题
DOI:
10.1109/tap.2020.2969851
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发表时间:
2020-02
影响因子:
5.7
通讯作者:
Jun Hu
中科院分区:
文献类型:
--
作者:
Xianjin Li;Lin Lei;Yongpin Chen;Ming Jiang;Ping-Hao Jia;Zhi Rong;Zaiping Nie;Jun Hu
A nonconformal and nonoverlapping domain decomposition method (DDM) based on hybrid volume and surface integral equation (VSIE) is presented for modeling complex thin dielectric/perfect electric conductor (PEC) composite targets. To reduce the unknown amount of the conventional volume integral equation (VIE) for thin dielectric bulks, the improved simplified prism vector (ISPV) basis function is developed. By using the basis function, the volume integrals can be simplified into surface integrals or line integrals, which significantly reduce the simulation time. Prism grids can also avoid the overmeshing problem for thin dielectrics. Moreover, they can be perfectly matched to the triangular meshes widely used in surface integral equation (SIE) hence assures a simple and robust VSIE implementation. Next, in order to increase the flexibility of geometrical modeling and accelerate the convergence of the presented VSIE system for electrically large and multiscale composite targets, a DDM is further developed. In this DDM scheme, discontinuous Galerkin approaches are, respectively, employed for VIE and SIE, accounting for conformal/nonconformal volume grids and surface grids between adjacent subdomains. In addition, an interior penalty term is introduced to stabilize the DDM solution. Finally, some numerical results are considered and analyzed to show the validity, efficiency, and applicability of the presented scheme.
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影响因子:
1.5
作者:
Lei, Lin;Hu, Jun;Hu, Hao-Quan
通讯作者:
Hu, Hao-Quan
影响因子:
5.7
作者:
RAO, SM;WILTON, DR;GLISSON, AW
通讯作者:
GLISSON, AW
影响因子:
5.7
作者:
J. Creticos;D. Schaubert
通讯作者:
J. Creticos;D. Schaubert
影响因子:
4.2
作者:
M. Jiang;J. Hu;M. Tian;R. Zhao;Z. P. Nie
通讯作者:
Z. P. Nie
影响因子:
5.7
作者:
He, Zi;Chen, Ru-Shan;Sha, Wei E. I.
通讯作者:
Sha, Wei E. I.