Effects of Surface Roughness on Interface Bonding Performance for 316H Stainless Steel in Hot-Compression Bonding
Effects of Surface Roughness on Interface Bonding Performance for 316H Stainless Steel in Hot-Compression Bonding
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DOI：
10.1007/s40195-023-01533-8
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发表时间：
2023-02
期刊：
影响因子：
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通讯作者：
Yong Zhao;Bijun Xie;Jin-long Zhang;Qinqiang Wang;Bin Xu;Jiang Guo;Zhu-Ji Jin;R. Kang;
中科院分区：
文献类型：
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作者：
Yong Zhao;Bijun Xie;Jin-long Zhang;Qinqiang Wang;Bin Xu;Jiang Guo;Zhu-Ji Jin;R. Kang;
在热压连接中，连接接头的冶金连接质量受基材表面状态的影响，而表面粗糙度是表面状态的核心指标。然而，对于具有难熔氧化膜的基板，表面粗糙度对HCB工艺中界面结合性能(IBP)的影响尚不清楚。研究了表面粗糙度对热轧316H不锈钢焊接接头IBP的影响。确定了316H不锈钢接头界面结合临界状态的HCB参数。在界面结合临界态的参数下，进行了表面粗糙度的影响放大实验。用界面形貌、元素分布和拉伸性能对IBP进行了表征。揭示了界面凹坑的形成机理，总结了凹坑数目随粗糙度的变化趋势。最后，建立了表面粗糙度与IBP之间的映射关系。结果表明，随着表面粗糙度的降低，旋转动态再结晶程度减弱，当表面粗糙度小于0.020μ时，界面结合机制完全转变为不连续动态再结晶。由于氧化膜聚集和磨料夹杂机制的减弱，界面凹坑数量随着粗糙度的降低而减少。当粗糙度低于0.698μmsa时，拉伸试件的延伸率不能显著增加。
The metallurgical bonding quality of bonding joints is affected by the substrate surface state in hot-compression bonding (HCB), and the surface roughness is a core indicator of the surface state. However, the effects of surface roughness on interface bonding performance (IBP) in the HCB process are unclear for substrates with refractory oxide scales. This study presents the effects of surface roughness on IBP for 316H stainless steel joints fabricated by HCB. A set of HCB parameters for interface bonding critical state of 316H stainless steel joints was determined. The HCB experiments were carried out under parameters of interface bonding critical state to amplify the effect of surface roughness. The interface morphologies, element distribution, and tensile properties were used to characterize the IBP. As a result, the formation mechanisms of the interface pits were revealed and the variation trend of pit number with the roughness was summarized. Finally, the mapping relation between surface roughness and IBP was established. The results show that the degree of rotational dynamic recrystallization becomes weaker with the decrease in the surface roughness and the interface bonding mechanism is completely transformed into discontinuous dynamic recrystallization when the roughness is lower than 0.020 μmSa. The number of interfacial pits decreases as the roughness decreases owing to the weakening of oxide scale aggregation and abrasive inclusion mechanism. The elongation of the tensile specimen cannot increase significantly while the roughness is lower than 0.698 μmSa.