O2 plasma treated polyimide-based humidity sensors.
O2 plasma treated polyimide-based humidity sensors.
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经过 O2 等离子体处理的聚酰亚胺湿度传感器。
DOI：
10.1039/b205085d
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
D. Thiel
中科院分区：
文献类型：
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作者：
Takeharu Suzuki;P. Tanner;D. Thiel
介绍了非等离子体处理和等离子体处理对聚酰亚胺湿度传感器的影响。使用纯氧在等离子体蚀刻机中蚀刻聚酰亚胺。在等离子体处理的传感器表现出更高的灵敏度和更快的响应速度对水分。等离子体处理的传感器具有3.4倍的灵敏度，并且响应速度几乎是非等离子体处理的传感器的两倍。传感器输出，灵敏度和响应速度的进一步比较。通过X射线光电子能谱（XPS）和傅里叶变换红外光谱（ATR-FTIR）对聚酰亚胺表面进行化学分析。XPS和ATR-FTIR表明等离子体处理后羰基碳键C=O增加。原子力显微镜（AFM）观察到的几何修改。在等离子体处理之后，其显示出相当大的表面粗糙度。氧等离子体处理提高了灵敏度，并减少了由于在聚酰亚胺中的C=O键的增加的传感器的滞后。
The effect of non-plasma and plasma treated polyimide-based humidity sensors is presented. Pure oxygen was used to etch polyimide in a plasma etcher. The sensor treated in a plasma exhibited higher sensitivity and faster response speed against moisture. The plasma treated sensor had 3.4 times the sensitivity and responded almost twice as fast as the non-plasma treated sensor. A further comparison of sensor outputs, sensitivity and response speed are presented. Chemical analysis of the polyimide surface was carried out by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (ATR-FTIR). XPS and ATR-FTIR showed the increase in carbonyl carbon bonds, C=O, after the plasma treatment. Geometrical modification was observed by atomic force microscopy (AFM). It showed considerable surface roughness after the plasma treatment. O2 plasma treatment improved the sensitivity, and reduced the hysteresis of the sensor due to the increase in C=O bonds in the polyimide.