The return of photoelastic stress measurements: utilizing birefringence to monitor damage and repair in healable materials
The return of photoelastic stress measurements: utilizing birefringence to monitor damage and repair in healable materials
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光弹性应力测量的回归：利用双折射监测可修复材料的损伤和修复
DOI：
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发表时间：
2011
期刊：
影响因子：
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通讯作者：
Erin B. Murphy
中科院分区：
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作者：
Erin B. Murphy
光弹性应力测量已被证明在分析透明聚合物材料内的残余应力和诱导应力方面非常有用。我们展示了聚合物双折射作为评估基于双环戊二烯热可逆狄尔斯-阿尔德环加成反应的可修复聚合物中损伤位置和类型以及修复程度的途径的实用性。这些可修复聚合物以受控方式承受压缩载荷，以创建等色应力校准曲线。然后利用双折射和应力之间的相关性来分析在压缩载荷下明显变形的样品；经过热愈合处理后，这些样品不仅恢复了其初始机械性能并恢复了其初始样品尺寸，而且还显示出损坏事件期间引起的残余应力的完全释放。这些和类似材料的光弹性特性可用作非接触和非破坏性方法，用于实时分析可修复材料的损伤和修复。
Photoelastic stress measurements have proven quite useful in the analysis of residual and induced stress within transparent polymer materials. We show the utility of polymer birefringence as an avenue for assessing location and type of damage, as well as the extent of repair, in healable polymers based on the thermally reversible Diels–Alder cycloaddition reaction of dicyclopentadiene. These healable polymers were subjected to compressive loading in a controlled fashion to create an isochromatic–stress calibration curve. The correlation between birefringence and stress was then utilized to analyze samples visibly deformed in compressive loading; following a thermal healing treatment, these samples not only regained their initial mechanical properties and recovered their initial specimen dimensions, but also showed a complete release of the residual stress induced during the damage event. The photoelastic properties of these and similar materials can be utilized as a non-contact and non-destructive method for real-time analysis of damage and repair in healable materials.