Holographic interferometric microscopy for measuring Cu2+ concentration profile during Cu electrodeposition in a magnetic field
Holographic interferometric microscopy for measuring Cu2+ concentration profile during Cu electrodeposition in a magnetic field
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DOI：
10.1016/j.electacta.2018.12.025
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发表时间：
2019-02
影响因子：
6.6
通讯作者：
K. Nishikawa;Takaki Saito;H. Matsushima;M. Ueda
中科院分区：
文献类型：
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作者：
K. Nishikawa;Takaki Saito;H. Matsushima;M. Ueda
我们测量了外加磁场下硫酸铜溶液中铜电沉积过程中的浓度边界层。使用全息激光干涉显微镜，我们证明了在阴极附近的扩散层的形成。在电沉积的初始阶段，扩散层在磁场中发生变形。对电极表面浓度的分析支持了以下论断：在没有磁场的情况下，当Cu 2+的表面浓度耗尽时形成枝晶;在有磁场的情况下，场梯度力和局部洛伦兹力的独特对流现象促进了扩散层中Cu 2+的传质，产生大晶粒。
We measured the concentration boundary layer during copper electrodeposition in a copper sulfate solution under an applied magnetic field. Using a holographic laser interference microscope, we demonstrated the formation of the diffusion layer near the cathode. In the initial stage of electrodeposition, the diffusion layer was distorted in a magnetic field. An analysis of the electrode surface concentration supported the following assertions: without a magnetic field, dendrites formed when the surface concentration of Cu2+was depleted; with a magnetic field, the unique convection phenomena of the field gradient force and localized Lorentz force promoted Cu2+mass transport in the diffusion layer, producing large crystal grains.