Dendrite-like Cu-based micro/nanomaterials fabricated on insulators by shielding ion transportation during electrochemical migration
Dendrite-like Cu-based micro/nanomaterials fabricated on insulators by shielding ion transportation during electrochemical migration
复制标题
通过屏蔽电化学迁移过程中的离子传输在绝缘体上制备枝晶状铜基微/纳米材料
DOI：
10.1016/j.matlet.2022.132735
复制
发表时间：
2022
影响因子：
3
通讯作者：
Yuan Li
中科院分区：
文献类型：
--
作者：
Takahisa Sugawara;Yasuhiro Kimura;Yuan Li
绝缘体上的金属基微/纳米材料在透明导电电极、智能纺织品和传感器等各种应用中引起了广泛的关注。在此，我们提出了一种通过屏蔽电化学迁移过程中的离子传输来在绝缘体上制造金属基微/纳米材料的简单方法。电压应力实验在两个由水隔开的平行铜电极上进行，并且在阴极内表面插入绝缘体。由于绝缘体屏蔽了传输的金属离子并防止电短路，因此在绝缘体上成功地制备了由纳米线和纳米颗粒组成的铜基枝晶。该过程可用于在任意绝缘体上设计各种金属基微/纳米材料，以实现多种应用。
Metal-based micro/nanomaterials on insulators have attracted extensive attention in various applications, such as transparent conductive electrodes, smart textiles, and sensors. Herein we proposed a straightforward method for fabricating metal-based micro/nanomaterials on insulators by shielding ion transportation during electrochemical migration. Voltage-stressing experiments were conducted on two parallel Cu electrodes separated by water, with an insulator inserted on the cathode inner surface. Since the insulator shielded the transported metal ions and prevented the electrical short, Cu-based dendrites composed of nanowires and nanoparticles were successfully fabricated on the insulator. The procedure can be applied to design diverse metal-based micro/nanomaterials on arbitrary insulators for versatile applications.