Amalgams for improved electronics interconnection
Amalgams for improved electronics interconnection
复制标题
用于改善电子互连的汞合金
作者：
C. MacKay
汞齐系统的特点，优点和潜在的应用，它提供了一个有前途的替代传统的电子焊料的温度较低（因此成本较低）的过程和组件，没有大多数焊料系统的环境缺点，进行了说明。汞齐合金是在室温或接近室温下在液态金属和粉末之间形成的非平衡机械合金材料。它们具有出色的热稳定性和上级接头强度以及热循环测量。讨论了镓/镍、镓/铜和镓/铜/镍汞齐合金。讨论了汞齐化方法、对电子汞齐的要求、汞齐硬化机理和汞齐润湿技术。介绍了汞合金在大芯片面积连接和倒装芯片中的应用。<<ETX>>
The characteristics, advantages, and potential applications of amalgam systems, which offer a promising alternative to traditional electronics solders for lower temperature (and hence lower cost) processes and components, without the environmental drawbacks of most solder systems, are described. Amalgams are nonequilibrium, mechanically alloyed materials formed at or near room temperature between a liquid metal and a powder. They offer exceptional thermal stability and superior joint strength and thermal cycle measurements. Gallium/nickel, gallium/copper, and gallium/copper/nickel amalgam alloys are discussed. The amalgamation methods, requirements for electronics amalgams, amalgam hardening mechanism, and amalgam wetting techniques are also discussed. Applications of amalgams to large die area attachments and flip chips are described.<<ETX>>