Polymeric packaging for fully implantable wireless neural microsensors.
Polymeric packaging for fully implantable wireless neural microsensors.
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用于完全植入式无线神经微传感器的聚合物封装。
DOI：
10.1109/embc.2012.6346038
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
Nurmikko,ArtoV
中科院分区：
文献类型：
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作者：
Aceros,Juan;Yin,Ming;Borton,DavidA;Patterson,WilliamR;Bull,Christopher;Nurmikko,ArtoV
我们提出了用于皮下，完全植入式，宽带和无线神经传感器的聚合物包装方法。描述了一种用于加速测试和表征生物相容性聚合物包装材料和工艺的新工具，沿着专门的测试装置，以模拟我们的完全植入式神经传感器组件、材料和制造工艺。简要介绍了植入式系统的沿着其当前基于聚二甲基硅氧烷（PDMS）的封装方法。提供了在猪和非人灵长类动物中植入多个神经传感器的体内测试结果。最后，介绍了一种新的增强聚合物薄膜材料，以补充目前采用的PDMS。这种薄层涂层材料基于六甲基二硅氧烷（HMDSO）和氧气（O2）的等离子体增强化学气相沉积（PECVD）工艺。
We present polymeric packaging methods used for subcutaneous, fully implantable, broadband, and wireless neurosensors. A new tool for accelerated testing and characterization of biocompatible polymeric packaging materials and processes is described along with specialized test units to simulate our fully implantable neurosensor components, materials and fabrication processes. A brief description of the implantable systems is presented along with their current encapsulation methods based on polydimethylsiloxane (PDMS). Results from in-vivo testing of multiple implanted neurosensors in swine and non-human primates are presented. Finally, a novel augmenting polymer thin film material to complement the currently employed PDMS is introduced. This thin layer coating material is based on the Plasma Enhanced Chemical Vapor Deposition (PECVD) process of Hexamethyldisiloxane (HMDSO) and Oxygen (O2).