Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution
Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution
复制标题
DOI：
10.1115/1.1811114
复制
发表时间：
2004-11
影响因子：
4
通讯作者：
Jeong-Woo Park;N. Kawasegi;N. Morita;Deug-Woo Lee
中科院分区：
文献类型：
--
作者：
Jeong-Woo Park;N. Kawasegi;N. Morita;Deug-Woo Lee
水溶液中的摩擦纳米光刻技术利用原子力显微镜作为加工工具，实现了硅的纳米级加工。特殊设计的带有钻石尖端的悬臂允许通过简单的划痕过程轻松形成氧化物图案。通过在金刚石针尖样品结沿针尖的扫描路径的衬底上快速形成薄的氧化层，同时对未被氧化层覆盖的区域进行刻蚀的工艺，可以制造出具有斜率的矩形结构。为了验证氧化物的腐蚀特性，在氢氧化钾和氢氟酸中进行了腐蚀。
The TNL (Tribo Nanolithography) method in aqueous solution uses the atomic force microscopy as a machining tool for the nanoscale fabrication of silicon. A specially designed cantilever with a diamond tip allows the formation of oxide patterns easily by a simple scratching process. A rectangular structure with a slope can be fabricated by a process in which a thin oxide layer rapidly forms in the substrate at the diamond-tip sample junction along the scanning path of the tip, and, simultaneously, the area uncovered with the oxide layer is being etched. Etching in KOH and HF is conducted to verify corrosion characteristics of oxide.