High-Performance Transparent Ultrabroadband Electromagnetic Radiation Shielding from Microwave toward Terahertz.

High-Performance Transparent Ultrabroadband Electromagnetic Radiation Shielding from Microwave toward Terahertz.
复制标题

DOI:
10.1021/acsami.3c10474
复制
发表时间:
2023-10
影响因子:
9.5
通讯作者:
Heyan Wang;Danni Zheng;Yilei Zhang;Lin Han;Zhibo Cao;Zhengang Lu;Jiubin Tan
Heyan Wang;Danni Zheng;Yilei Zhang;Lin Han;Zhibo Cao;Zhengang Lu;Jiubin Tan
中科院分区:
材料科学2区
文献类型:
--
作者:
Heyan Wang;Danni Zheng;Yilei Zhang;Lin Han;Zhibo Cao;Zhengang Lu;Jiubin Tan

文献摘要

相似文献

在第五代网络和物联网时代,多波段电磁辐射屏蔽的使用对于下一代电子设备是非常期望的。在这里,我们报告了一个系统的探索超薄银基屏蔽原型(USP)薄膜结构在纳米尺度上的光电行为,解锁透明的超宽带电磁干扰(EMI)屏蔽从微波到太赫兹频率。提出了一个理论模型,以优化USP结构,以实现更高的透明度,从而引入光学谐振的电磁干扰,结合显着的EMI屏蔽能力。USP可以实现最先进的有效电磁辐射屏蔽带宽,测量频率从8 GHz到2 THz。实验结果表明,一个基本的USP(dAg = 10 nm)提供了一个平均屏蔽效率为27.5 dB的X至Ka波段(8-40 GHz),并保持了一个稳定的屏蔽性能为22.6 dB的宽范围内的0.5-2太赫兹,与测量的光学透射率为95.2%。超薄银基薄膜结构的卓越性能为下一代电子产品的潜在应用提供了新的超宽带EMI屏蔽范例。
In the era of fifth-generation networks and Internet-of-Things, the use of multiband electromagnetic radiation shielding is highly desirable for next-generation electronic devices. Herein, we report a systematic exploration of optoelectronic behaviors of ultrathin-silver-based shielding prototype (USP) film structures at the nanometer scale, unlocking the transparent ultrabroadband electromagnetic interference (EMI) shielding from microwave to terahertz frequencies. A theoretical model is proposed to optimize USP structures to achieve increased transparency, whereby optical antireflection resonances are introduced in dielectrics in conjunction with remarkable EMI shielding capability. USP can realize a state-of-the-art effective electromagnetic radiation shielding bandwidth with measured frequencies from 8 GHz up to 2 THz. Experimental results show that a basic USP (dAg = 10 nm) offers an average shielding efficiency of ∼27.5 dB from the X- to Ka-bands (8-40 GHz) and maintains a stable shielding performance of ∼22.6 dB across a broad range of 0.5-2 THz, with a measured optical transmittance of ∼95.2%. This extraordinary performance of ultrathin-silver-based film structures provides a new ultrabroadband EMI shielding paradigm for potential applications in next-generation electronics.