Embedded solutions: Fan-out and Embedded Die Packages market and technology trends
Embedded solutions: Fan-out and Embedded Die Packages market and technology trends
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嵌入式解决方案：扇出和嵌入式芯片封装市场和技术趋势
DOI：
10.4071/isom-2015-wa31
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
J. Azémar
中科院分区：
文献类型：
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作者：
J. Azémar
嵌入式包如今不再仅仅是某些特定应用程序的一种有趣的方法。受益于3D TSV的高成本和因此的延迟，这些封装可以满足行业的高期望。事实上，对于制造商来说，嵌入式封装在集成度、可靠性甚至系统级成本方面的附加值已经很清楚了。嵌入式套餐在2013-2014年前一直没有取得成功，因为资质时间长，参与者少，客户说服时间长。随着新产品的发布和一些关键参与者的大力参与，情况发生了变化。在本演示中，我们将重点介绍目前最受关注的两种主要类型的嵌入式封装：扇出封装和嵌入式芯片封装。扇出技术的原理是将产品嵌入模压化合物中，并允许再分布层间距与模具尺寸无关。这种方法已经足够成熟，足以让Nanium和Stats ChipPAC使用...
Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key players. In this presentation we will focus on two main types of embedded packages, those that are most of interest at the moment: Fan-Out and Embedded Dies packages. The principle of Fan Out technology is to embed products in a molded compound and allow redistribution layers pitch to be independent from die size. This approach is already mature enough to have high volume products claimed by Nanium and Stats ChipPAC usi...