Thermal performance of flat vapor chamber heat spreader

Thermal performance of flat vapor chamber heat spreader
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DOI:
10.1016/j.enconman.2007.10.024
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发表时间:
2008-06
影响因子:
10.4
通讯作者:
S. Hsieh;R. Lee;Jin‐Cherng Shyu;Shao-Wen Chen
S. Hsieh;R. Lee;Jin‐Cherng Shyu;Shao-Wen Chen
中科院分区:
工程技术1区
文献类型:
--
作者:
S. Hsieh;R. Lee;Jin‐Cherng Shyu;Shao-Wen Chen

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实验研究了中心热源的扩散热阻和用于电子冷却的充水重力辅助平板蒸汽室的热性能。对不同的热流密度和工作温度进行了参数研究,从扩散阻力的角度讨论了相关参数对制冷性能的影响。本蒸汽室散热器的散热能力为220W/cm2,热扩散阻力为0.2°C/W。
Experiments were performed to examine the spreading thermal resistance of centrally positioned heat sources and the thermal performance of a water charged, gravity assisted flat vapor chamber to be used for electronic cooling. Parametric studies including different heat fluxes and operating temperatures were conducted, and the effect of the relevant parameters on the cooling performance in terms of the spreading resistance was presented and discussed. The present vapor chamber heat spreader showed a heat removal capacity of 220W/cm2with a thermal spreading resistance of 0.2°C/W.