Nanosecond pulsed laser irradiation of metal for processing microgroove with vertical sidewalls

Nanosecond pulsed laser irradiation of metal for processing microgroove with vertical sidewalls
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DOI:
10.2351/7.0000249
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发表时间:
2021-02
影响因子:
2.1
通讯作者:
Zhenyuan Jia;Wang Jian;Jian-wei Ma;Wang Xulin-;Jiang Wenwen-;Han Dongxu-
Zhenyuan Jia;Wang Jian;Jian-wei Ma;Wang Xulin-;Jiang Wenwen-;Han Dongxu-
中科院分区:
工程技术4区
文献类型:
--
作者:
Zhenyuan Jia;Wang Jian;Jian-wei Ma;Wang Xulin-;Jiang Wenwen-;Han Dongxu-

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激光加工广泛应用于表面图案的制造。但在一些产业需求下,它也面临着新的挑战。例如,精细覆层电路要求金属层深度精确蚀刻,以保证对基板的轻微损伤,并且形成的导电轨道具有垂直侧壁以实现更高的精度。前者可以通过合理控制工艺参数来实现,但后者由于光斑能量分布呈高斯分布,很难通过常规激光铣削实现。针对这种情况,提出了一种新的激光加工方法——预刻蚀后修边,以减小刻蚀边缘的锥角。其特点是附加修整工艺,有序规划激光工艺参数,使其效果相对独立,并引入多轴加工技术,实现斜入射刻蚀。为了控制预刻蚀中的刻蚀深度,通过建立垂直入射激光烧蚀模型来预测微槽的烧蚀结果。进一步建立了斜入射激光烧蚀模型,研究了侧壁修整工艺参数的规划方法。所提出的加工方法的操作是通过五轴激光加工机床完成的。结果表明,所制备的微槽的锥角小于3°(减小程度>90%)。该研究成果改善了激光固有特性造成的侧壁倾斜问题,对于制造高质量边缘的表面图案具有实际应用价值。
Laser processing is widely used in the manufacture of surface patterns. However, it faces new challenges under some industrial demands. For example, the fine cladding circuit requires that the metal layer is precisely etched in depth for slight damage to the substrate and the formed conductive tracks have vertical sidewalls for higher precision. The former can be achieved by a reasonable control of the process parameters, but the latter is difficult to realize by conventional laser milling since the energy distribution of the spot is Gaussian. In this situation, a new laser processing method, pre-etching then sidewall trimming, is proposed to reduce the taper angle of the etched edge. It features an additional trimming process in which the laser process parameters are planned orderly for their relatively independent effect, and the multiaxis machining technology is introduced to realize the etching with oblique incidence. To control the etching depth in pre-etching, the ablation result of microgroove is predicted by building the laser ablation model at vertical incidence. Furthermore, the laser ablation model at oblique incidence is developed and the planning method of process parameters for the sidewall trimming is researched. The operation of the proposed processing method is completed through a five-axis laser processing machine tool. It is demonstrated that the prepared microgroove has the taper angle less than 3° (decrease degree > 90%). The research achievements improve the sloping sidewalls caused by the inherent characteristic of laser, which has practical application value for manufacturing the surface pattern with high-quality edge.