Free-standing laser-induced graphene films for high-performance electromagnetic interference shielding
Free-standing laser-induced graphene films for high-performance electromagnetic interference shielding
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DOI：
10.1016/j.carbon.2021.07.055
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发表时间：
2021-10
期刊：
影响因子：
10.9
通讯作者：
Wen-Shen Yu;Yunyan Peng;Lijun Cao;Weiwei Zhao;Xiaoqing Liu
中科院分区：
文献类型：
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作者：
Wen-Shen Yu;Yunyan Peng;Lijun Cao;Weiwei Zhao;Xiaoqing Liu
虽然激光诱导石墨烯（LIG）在成本和制造工艺上具有很大的优势，但由于其导电性不突出和固有衬底的限制，在电磁干扰（EMI）屏蔽领域的报道很少。在这项工作中，选择聚苯并恶嗪作为前驱体，通过一步离焦激光工艺制备LIG。由于优越的多孔结构和高导电性，制备的LIG在68 μm厚度下的x波段EMI屏蔽效率高达24.8 dB。无溶剂法制备的LIG/ fe3o4复合材料在53 μm厚度下的电磁屏蔽效果达到32.7 dB。在考虑厚度和轻量化的同时，其绝对屏蔽效果也超过了大多数其他碳基屏蔽材料。更重要的是，利用碳材料和聚合物衬底热膨胀系数的差异，我们开发了一种快速淬火剥离（RQP）策略，将LIG与聚合物衬底分离，从而获得独立的LIG薄膜。此外，LIG的结构和性能保存完好。剥离后的独立LIG薄膜在实际电磁干扰屏蔽应用中具有更广泛的适应性，也为焦耳加热装置等其他领域的应用开辟了可能性。
Although laser-induced graphene (LIG) has great advantages in the cost and manufacturing process, it has been seldom reported in the field of electromagnetic interference (EMI) shielding due to its unobtrusive conductivity and the limitation of inherent substrates. In this work, polybenzoxazine is chosen as precursor to fabricate the LIG via a one-step defocused lasing process. As a result of favorable porous structures and high conductivity, the as-produced LIG exhibits the EMI shielding effectiveness up to 24.8 dB in X-band at the thickness of 68 μm. And the EMI shielding effectiveness of LIG/Fe3O4composite is increased to 32.7 dB at a smaller thickness of 53 μm which is obtained by a solvent-free approach. When considering the thickness and lightweight properties, the absolute shielding effectiveness is also surpassing most of the other carbon-based shielding materials. More importantly, taking advantage of the difference in the thermal expansion coefficient of carbon material and polymeric substrate, we develop a rapid quench-peeling (RQP) strategy for the separation of LIG from polymeric substrate to obtain the free-standing LIG film. Moreover, the structures and properties of LIG are well preserved. The free-standing LIG films after peeling have wider adaptability in practical EMI shielding applications, and also opened up possibilities for use in other fields, such as Joule heating device.