Metal-matrix composites embedded with piezoelectric PVDF sensors using ultrasonic additive manufacturing
Metal-matrix composites embedded with piezoelectric PVDF sensors using ultrasonic additive manufacturing
复制标题
使用超声波增材制造嵌入压电 PVDF 传感器的金属基复合材料
DOI：
10.1117/12.2581845
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发表时间：
2021
期刊：
影响因子：
--
通讯作者：
Dapino, Marcelo J.
中科院分区：
文献类型：
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作者：
Ramanathan, Arun Kumar;Gingerich, M. Bryant;Headings, Leon M.;Dapino, Marcelo J.
具有活性组分的金属基复合材料已经被研究作为使金属功能化的一种方式。与表面安装方法相反，嵌入金属中的智能材料可以有效地屏蔽环境，同时提供原位传感，健康监测，驱动或能量收集功能。然而，典型的制造方法可能是有问题的，因为它们可能物理损坏智能材料或降低其机电性能。例如，非树脂基嵌入工艺（如粉末冶金）涉及等静压和扩散结合，导致高工艺温度和待嵌入有源部件的机电性能的破坏。本文介绍了一种铝基复合材料的开发和表征嵌入压电聚偏氟乙烯（PVDF）传感器使用超声增材制造（UAM）。UAM结合了固态、超声波金属焊接和减成法工艺的原理，以制造具有无缝嵌入式智能材料且无热负荷的金属基体。如本研究中所实施的，UAM工艺使用接收时的市售Al 6061胶带箔材和TE Connectivity PVDF薄膜。为了增加传感器和金属基体之间的机械耦合而无需粘合剂的帮助，PVDF传感器嵌入有由焊接在传感器上方的带箔限定的经验优化的预压缩。通过拉伸（d31模式）、弯曲（d31模式）和压缩测试（d33模式）对样本进行表征，以评估其功能性能。在所研究的负载范围内，试样表现出开路灵敏度为4.6 mV/N下的单轴拉伸和9.7 mV/N下的压缩脉冲测试，具有优于95%的线性度和几千赫的频率带宽。本研究中提出的技术可应用于负载和触觉传感、冲击检测和定位、热测量、能量收集和无损检测应用。
Metal-matrix composites with active components have been investigated as a way to functionalize metals. As opposed to surface-mounted approaches, smart materials embedded in metals can be effectively shielded against the environment while providing in-situ sensing, health monitoring, actuation, or energy harvesting functions. Typical manufacturing approaches can be problematic, however, in that they may physically damage the smart material or degrade its electromechanical properties. For instance, non-resin-based embedment procedures such as powder metallurgy involve isostatic compression and diffusion bonding, leading to high process temperatures and breakdown of the electromechanical properties of the active component to be embedded. This paper presents the development and characterization of an aluminum-matrix composite embedded with piezoelectric polyvinylidene fluoride (PVDF) sensors using ultrasonic additive manufacturing (UAM). UAM incorporates the principles of solid-state, ultrasonic metal welding and subtractive processes to fabricate metal-matrices with seamlessly embedded smart materials and without thermal loading. As implemented in this study, the UAM process uses as-received, commercial Al 6061 tape foilstock and TE Connectivity PVDF film. In order to increase the mechanical coupling between the sensor and the metal-matrix without the aid of adhesives, the PVDF sensor is embedded with an empirically optimized pre-compression defined by the tape foils welded above the sensor. The specimen is characterized by tensile (d31 mode), bending (d31 mode), and compression tests (d33 mode) to evaluate its functional performance. Within the investigated load range, the specimen exhibits open-circuit sensitivities of 4.6 mV/N under uniaxial tension and 9.7 mV/N under compressive impulse tests with better than 95% linearity and frequency bandwidth of several kilohertz. The technology presented in this study could be applied for load and tactile sensing, impact detection and localization, thermal measurements, energy harvesting, and non-destructive testing applications.