Dense Fe cluster-assembled films by energetic cluster deposition
Dense Fe cluster-assembled films by energetic cluster deposition
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DOI：
10.1063/1.1801170
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发表时间：
2004-10-04
影响因子：
4
通讯作者：
Sumiyama, K
中科院分区：
文献类型：
--
作者：
Peng, DL;Yamada, H;Sumiyama, K
利用高能团簇沉积技术在室温下制备了高密度的Fe团簇组装薄膜。虽然团簇组装通常是煤烟和多孔的，但目前的Fe团簇组装的薄膜是有光泽和致密的，显示出软磁行为。用等离子体凝聚法制备了平均尺寸为d=9 nm的单分散Fe团簇。电离团簇被电加速，并与来自同一团簇源的中性团簇一起沉积到衬底上。随着加速电压的增加，堆积分数和饱和磁通密度迅速增加，矫顽力显著降低。在-20kV加速电压下得到的Fe团簇组装膜的堆积分数为0.86+/-0.03，饱和磁通密度为1.78+/-0.05WB/m(2)，矫顽力小于80A/m，室温下的电阻率是大块Fe金属的10倍。(C)2004年美国物理研究所。
High-density Fe cluster-assembled films were produced at room temperature by an energetic cluster deposition. Though cluster-assemblies are usually sooty and porous, the present Fe cluster-assembled films are lustrous and dense, revealing a soft magnetic behavior. Size-monodispersed Fe clusters with the mean cluster size d=9 nm were synthesized using a plasma-gas-condensation technique. Ionized clusters are accelerated electrically and deposited onto the substrate together with neutral clusters from the same cluster source. Packing fraction and saturation magnetic flux density increase rapidly and magnetic coercivity decreases remarkably with increasing acceleration voltage. The Fe cluster-assembled film obtained at the acceleration voltage of -20 kV has a packing fraction of 0.86+/-0.03, saturation magnetic flux density of 1.78+/-0.05 Wb/m(2), and coercivity value smaller than 80 A/m. The resistivity at room temperature is ten times larger than that of bulk Fe metal. (C) 2004 American Institute of Physics.