Effect of Cu and Sn on liquid–liquid interfacial energy in ternary and quaternary Al–Bi-based monotectic alloys
Effect of Cu and Sn on liquid–liquid interfacial energy in ternary and quaternary Al–Bi-based monotectic alloys
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DOI：
10.1016/j.msea.2007.08.097
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发表时间：
2008-11
期刊：
影响因子：
6.4
通讯作者：
I. Kaban;W. Hoyer
中科院分区：
文献类型：
--
作者：
I. Kaban;W. Hoyer
研究了Cu和Sn对富Al和富Bi液相界面能的影响。当Cu添加到Al 34.5Bi 65.5中时，液-液界面张力增加（数字表示wt.%）。二进制，它是减少时，Sn的加入。在二元Al-Bi合金中同时加入等量的Cu和Sn，可使低温界面张力降低，高温界面张力升高。所研究的合金中界面张力的温度依赖性可以用函数σαβ=σ0（1-T/TC）μ很好地描述，其中σ 0为常数，临界点指数μ=1.3。
The influence of Cu and Sn on the interfacial energy between Al-rich and Bi-rich liquids has been studied. The liquid–liquid interfacial tension is increased when Cu is added to the Al34.5Bi65.5(numbers indicate wt.%) binary and it is decreased when Sn is added. Simultaneous addition of Cu and Sn in equal quantity to the binary Al–Bi alloy results in a decrease of the interfacial tension at low temperature and in its increase at high temperature. Temperature dependences of the interfacial tension in the alloys studied are well described by the function σαβ=σ0(1−T/TC)μwith a constant σ0and the critical-point exponent μ=1.3.