Conveyance Method of Thin Plate by Using Multiple-phase Air Flow
Conveyance Method of Thin Plate by Using Multiple-phase Air Flow
复制标题
利用多相气流输送薄板的方法
DOI：
10.1002/ecj.12044
复制
发表时间：
2018
影响因子：
0.3
通讯作者：
Akira Urita
中科院分区：
文献类型：
--
作者：
Katsushi Furutani;Yusuke Nakamura;Akira Urita
本文介绍了一种多相气流悬浮薄板的传递方法。为了保持玻璃板和半导体晶片的清洁，需要采用非接触式的转移方法。在该方法中，通过吹吸节流板上的空气，使薄板以小的倾角轻微悬浮，并将气流吹向薄板的下侧，从而产生驱动力。通过根据板的位置改变气流模式来连续承载板。空气流槽48个，间隔15 mm。直径90 mm×10 0 mm×2 mm、重量139g的平板在加速15 mm/S 2时速度几乎呈线性增长，驱动3号S后速度达到5 0 mm/S，在正负限流器气压为+7.0kpa和-3.0kpa时，悬浮高度分别为0.13 mm和0.2 8 mm。在初始速度为60 mm/S的情况下，移动100 mm后进行反向翻转。通过反转气流模式，板可以往复运动。
This paper deals with a transfer method for a thin plate by levitating with multiphase air flow. Non-contact transfer methods are required for glass plates and semiconductor wafers in order to keep them clean. In the proposed method, a thin plate was slightly levitated with a small inclination by blowing and sucking air from orifice restrictors, and airflow was blown against the lower side of the plate so that the driving force was generated. The plate was continuously carried by shifting the air flow pattern in accordance with the plate position. 48 air flow slots were arranged with intervals of 15 mm. The velocity of a plate with dimensions of 90 mm× 100 mm× 2 mm and a weight of 139 g was almost linearly increased at an acceleration of 15 mm/s 2 and reached 50 mm/s after driving for 3 s. The levitated height was 0.13 and 0.28 mm at the lower and higher sides at air pressures of the positive and negative restrictors of+ 7.0 and less than-3.0 kPa, respectively. In the case of an initial velocity of 60 mm/s, the plate was turned in reverse after moving for 100 mm. The plate can move reciprocally by reversing the air flow pattern.