Cu/Si interface fracture due to fatigue of copper film in nanometer scale
Cu/Si interface fracture due to fatigue of copper film in nanometer scale
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DOI：
10.1016/j.msea.2010.07.002
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发表时间：
2010-09
期刊：
影响因子：
6.4
通讯作者：
T. Sumigawa;Tadashi Murakami;T. Shishido;T. Kitamura
中科院分区：
文献类型：
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作者：
T. Sumigawa;Tadashi Murakami;T. Shishido;T. Kitamura
为了研究纳米尺度下金属材料的疲劳行为，采用纳米试样进行了循环弯曲试验。该样品包括一个铜膜的厚度为20 nm的高度刚性的材料，这产生了一个高应变区域的界面边缘附近的几个纳米的大小的约束。在第7次疲劳循环（载荷范围为18μN）中，样本在达到最大载荷前断裂。载荷-位移曲线显示出非线性行为和明显的滞后回线，表明Cu膜中的塑性。在第二次循环后出现的反向屈服表明Cu膜中的循环子结构的发展。Cu膜断裂时的累积塑性应变是单调加载时的3倍以上。这些结果表明，由于纳米级Cu膜的疲劳，试样断裂。
In order to investigate the fatigue behavior of metals in nanoscale, a cyclic bending experiment is carried out using a nano-specimen. The specimen includes a copper film with a thickness of 20nm constrained by highly rigid materials, which yields a high strain region with a size of a few nanometers near the interface edge. The specimen broke before the maximum load in the 7th cycle under fatigue (load range of 18μN). The load-displacement curve shows nonlinear behavior and a distinct hysteresis loop, indicating plasticity in the Cu film. Reverse yielding appearing after the 2nd cycle suggests the development of a cyclic substructure in the Cu film. The cumulative plastic strain in the Cu film at fracture is more than three times larger than that under monotonic loading. These results indicate that the specimen breaks owing to fatigue of the Cu film on the nanoscale.