Influence of shock loading kinetics on the spall response of copper
Influence of shock loading kinetics on the spall response of copper
复制标题
冲击载荷动力学对铜剥落响应的影响
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
C. Bronkhorst
中科院分区：
文献类型：
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作者：
J. Escobedo;E. Cerreta;D. Dennis;B. Patterson;C. Bronkhorst
设计并进行了一系列平板冲击实验，研究加载动力学对高纯铜层裂响应的影响。峰值压缩应力（1.5 GPa）和动态加载的晶界密度保持恒定的所有实验。张力脉冲的动力学设计使用流体动力学，冲击波传播代码和实验通过控制铜冲击器和目标的几何形状实现。损伤场的检查表明，总分数的损伤（空隙）的拉伸速率降低而增加。此外，伴随较大的塑性耗散，在晶粒取向差的形式测量的电子背散射衍射，是存在于样品中变形在较低的拉伸速率。这些结果表明，时间依赖的行为的过程中，塑性过程的空洞增长。
A suite of plate-impact experiments was designed and conducted to examine the influence of loading kinetics on the spall response of high purity copper samples. The peak compressive stresses (1.5 GPa) and the density of grain boundaries dynamically loaded were held constant for all experiments. The kinetics of the tensile pulses were designed using a hydrodynamic, shock-wave propagation code and experimentally achieved by controlling the geometry of copper impactors and targets. Examination of damage fields shows that the total fraction of damage (voids) increases as the tensile rates decrease. In addition, an accompanying larger plastic dissipation, in the form of grain misorientation measured by means of electron backscatter diffraction, is present in the samples deformed at lower tensile rates. These results suggest a time dependent behaviour of the processes the plastic processes for void growth.