Microelectromechanical Systems for Nanomechanical Testing: Electrostatic Actuation and Capacitive Sensing for High-Strain-Rate Testing
Microelectromechanical Systems for Nanomechanical Testing: Electrostatic Actuation and Capacitive Sensing for High-Strain-Rate Testing
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DOI:
10.1007/s11340-019-00565-5
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发表时间:
2020-03
影响因子:
2.4
通讯作者:
Chengjun Li;D. Zhang;G. Cheng;Yong Zhu
中科院分区:
文献类型:
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作者:
Chengjun Li;D. Zhang;G. Cheng;Yong Zhu
There have been relatively few studies on mechanical properties of nanomaterials under high strain rates, mainly due to the lack of capable nanomechanical testing devices. Here we present a new on-chip microelectromechanical system (MEMS) for high strain-rate nanomechanical testing. The MEMS device consists of an electrostatic comb drive actuator, two capacitive displacement sensors and a load cell. The dynamic responses of the device in air and in vacuum are systematically modeled under both alternating and ramp forces. Two methods, capacitive readout and high-speed imaging, are used to measure the dynamic displacements, which agree well with the modeling results. While we demonstrate the maximum constant strain rate over 200 s−1under ramp force, it is interesting to find that the capacitive readout used in this work can only measure strain rate up to 22 s−1due to its limit in bandwidth. To demonstrate the utility of this new device, gold nanowires are tested at strain rates of 10−5and 10 s−1inside a scanning electron microscope. Increasing strain rate is found to yield higher yield strength and larger ductility.