Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections
Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections
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DOI：
10.1109/tcapt.2007.910128
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发表时间：
2008-03
影响因子：
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通讯作者：
Jong‐Woong Kim;Dae-Gon Kim;Young-Chul Lee;Seung-Boo Jung
中科院分区：
文献类型：
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作者：
Jong‐Woong Kim;Dae-Gon Kim;Young-Chul Lee;Seung-Boo Jung
通过测量连接电阻来研究各向异性导电膜（ACF）和非导电膜（NCF）互连的失效行为。采用四点探针法测量了硅芯片上的金凸块和柔性印刷电路板上的铜焊盘构成的粘合接头的连接电阻。通过多次回流焊工艺评估互连可靠性。 ACF接头的连接电阻明显高于NCF接头，这主要是由于ACF接头中电流的收缩和导电颗粒的固有电阻所致。对于ACF和NCF接头，两个互连的连接电阻随着键合力的增加而减小，随后在键合力为70和80N时分别收敛到约10和1mΩ。在回流焊过程中，观察到两种不同的传导行为：连接电阻增加和欧姆行为终止。前者是由于粘合剂的 z 方向膨胀导致接触面积减少，而后者是由于粘合剂接头中的接触开口或界面开裂引起的。
Failure behaviors of anisotropic conductive film (ACF) and non-conductive film (NCF) interconnects were investigated by measuring the connection resistance. The four-point probe method was used to measure the connection resistance of the adhesive joints constructed with Au bump on Si chip and Cu pad on flexible printed circuit. The interconnection reliability was evaluated by multiple reflow process. The connection resistance of the ACF joints was markedly higher than that of NCF joints, mainly due to the constriction of the current flow and the intrinsic resistance of the conductive particles in ACF joints. The connection resistances of both interconnections decreased with increasing bonding force, and subsequently converged to about 10 and 1 mOmega at a bonding force of 70 and 80 N, for the ACF and NCF joints, respectively. During the reflow process, two different conduction behaviors were observed: increased connection resistance and the termination of Ohmic behavior. The former was due to the decreased contact area caused by z-directional swelling of the adhesives, whereas the latter was caused by either contact opening in the adhesive joints or interface cracking.