Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
复制标题
DOI：
10.1007/s11664-000-0013-8
复制
发表时间：
2000-10-01
影响因子：
2.1
通讯作者：
Kao, CR
中科院分区：
文献类型：
--
作者：
Chen, C;Ho, CE;Kao, CR
研究了Ni与共晶BiSn焊料在85℃、100℃、120℃和135℃下的反应。使用的反应时间范围为25小时至3600小时。反应结果仅检测到 Ni3Sn4。没有观察到其他Ni;Sn金属间化合物和Ni-Bi金属间化合物。 Ni3Sn4 的生长遵循扩散控制动力学，并且非常缓慢，在 135 ℃ 时效 3600 h 后，层厚仅达到 16 μm。共晶 BiSn 显微组织很快粗化。在 135 摄氏度下仅老化 200 小时即可观察到明显的粗化。此外，在焊料的富锡相内发现了细小的富Bi颗粒。这些细小的富Bi颗粒的数量随着时效温度的升高而增加。据信，这些细小的富Bi颗粒的形成是由于富Sn相可以溶解大量的Bi。还发现，随着时效时间的增加，紧邻 Ni3Sn4 层的区域优先被富 Bi 相占据。这是因为该区域的 Sn 与 Ni 反应形成 Ni3Sn4，在 Ni3Sn4 上方留下几乎连续的富 Bi 相。由于富铋合金往往很脆，几乎连续的富铋相可能会削弱焊点的强度。 Ni3Sn4晶粒尺寸从Ni/Ni3Sn4界面到Ni3Sn4/BiSn界面逐渐增大，这可能是奥斯特瓦尔德熟化现象。
The reaction between Ni and eutectic BiSn solder at 85 degrees C, 100 degrees C, 120 degrees C, and 135 degrees C was studied. Reaction times ranging from 25 h to 3600 h were used. Only Ni3Sn4 was detected as a result of the reaction. None of the other Ni;Sn intermetallic compounds and none of the Ni-Bi intermetallic compounds were observed. The growth of Ni3Sn4 followed diffusion-controlled kinetics and was very slow, with the layer thickness reaching only 16 mu m after 3600 h of aging at 135 degrees C. The eutectic BiSn microstructure coarsened very quickly. Substantial coarsening can be observed at 135 degrees C for only 200 h of aging. Ln addition, fine Bi-rich particles within the Sn-rich phase of the solder were found. The amount of these fine Bi-rich particles increased with the aging temperature. It is believed that the formation of these fine Bi-rich particles is due to the fact that the Sn-rich phase can dissolve substantial amounts of Bi. It was also found that, as aging time increased, the region immediately adjacent to the Ni3Sn4 layer was preferentially occupied by the Bi-rich phase. This is because Sn in that region had reacted with Ni to form Ni3Sn4, leaving a nearly continuous Bi-rich phase above the Ni3Sn4. Since Bi-rich alloys tend to be brittle, a nearly continuous Bi-rich phase might weaken the strength of a solder joint. The Ni3Sn4 grain size increased gradually from the Ni/Ni3Sn4 interface to the Ni3Sn4/BiSn interface, which is probably an Ostwald ripening phenomenon.