Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling
Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling
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DOI：
10.1007/s12217-009-9137-5
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发表时间：
2009-06
影响因子：
1.8
通讯作者：
Jinjia Wei;Jianfu Zhao;Minzhe Yuan;Yanfang Xue
中科院分区：
文献类型：
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作者：
Jinjia Wei;Jianfu Zhao;Minzhe Yuan;Yanfang Xue
为了有效冷却高热流密度的电子元件，对FC-72在尺寸为10×10×0.5 mm~3的方形硅片上的流动沸腾换热性能进行了实验研究。采用干法腐蚀强化沸腾换热技术，在芯片表面制备了4种尺寸分别为30×60、30×120、50×60、50×120μm2(厚度、t×高度、h)的微针刺翅片。为了进行比较，光滑的表面也进行了测试。实验是在三种不同的流体速度(0.5、1和2µm/S)和三种不同的液体过冷度(15、25和35µK)下进行的。将计算结果与已发表的池沸腾实验数据进行了比较。与光滑表面相比，所有微针细化表面都表现出相当大的换热强化。与池沸腾相比，流动沸腾能显著降低壁面过热度。在速度低于1米/S的情况下，随着壁面过热度的增加，微针翅片表面的热流密度急剧增加。对于所有表面，LSI芯片正常运行的最大允许热流密度qmax随着流体速度和过冷度的增加而增加。对于所有的微针翅片表面，临界热流密度处的壁温都小于大规模集成电路芯片可靠运行的上限85℃。在流体速度为2米/S、液体过冷度为35℃的情况下，翅片高度为120μm的微针翅片的最大Qmax可达近148W/cm2。展望了未来计划在北京落塔进行的微针翅片表面沸腾换热实验的前景。
For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10 × 10 × 0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30 × 60, 30 × 120, 50 × 60, 50 × 120 μm2(thickness,t× height,h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux,qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85°C. The largest value ofqmaxcan reach nearly 148 W/cm2for micro-pin-finned chips with the fin height of 120 μm at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned surfaces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented.