Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing.
Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing.
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累积滚压结合后续退火超细晶铜的显微组织和力学性能
DOI：
10.3390/ma13225171
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发表时间：
2020-11-16
期刊：
影响因子：
--
通讯作者：
Zhao Y
中科院分区：
文献类型：
--
作者：
Liu X;Zhuang L;Zhao Y
近年来，累积叠轧焊（ARB）技术在制备各种超细晶金属和合金方面取得了重大进展。在这项工作中，UFG铜板生产ARB和随后在300 °C下退火60分钟，以优化强度和延展性。结果发现，均匀的层状UFG材料的厚度为200-300 nm后，六个ARB通过形成。随着变形量的增加，抗拉强度和显微硬度增加，塑性和应变硬化降低。试样宏观上呈脆性断裂，微观上呈韧性断裂。退火后，高应变能界面处发生不连续再结晶，且发生不连续再结晶的时间早于基体。再结晶速率随累积应变的增加而增加。六道次退火后的UFG Cu ARBed显示出完全再结晶的组织，晶粒尺寸约为5 ~ 10 μm。退火处理降低了UFG Cu的显微硬度和抗拉强度，但提高了塑性和应变硬化。退火后的UFG-Cu以韧性断裂模式断裂，主要为韧窝和剪切带。我们的工作通过探索一种简单、低成本的制造技术，推进了UFG Cu的工业规模生产。
Recently, the accumulative roll bonding (ARB) technique has made significant progress in the production of various ultrafine-grained (UFG) metals and alloys. In this work, a UFG copper sheet was produced by ARB and subsequent annealing at 300 °C for 60 min to optimize strength and ductility. It was found that homogeneous lamellar UFG materials with a thickness of 200–300 nm were formed after six ARB passes. The microhardness and tensile strength of as-ARBed Cu increased, while the ductility and strain hardening decreased with the cumulative deformation strain. The as-ARBed specimens fractured in a macroscopically brittle and microscopically ductile way. After annealing, discontinuous recrystallization occurred in the neighboring interface with high strain energy, which was prior to that in the matrix. The recrystallization rate was enhanced by increasing the cumulative strain. UFG Cu ARBed for six passes after annealing manifested a completely recrystallized microstructure with grain sizes approximately ranging from 5 to 10 μm. Annealing treatment reduced the microhardness and tensile strength but improved the ductility and strain hardening of UFG Cu. As-annealed UFG-Cu fractured in a ductile mode with dominant dimples and shear zones. Our work advances the industrial-scale production of UFG Cu by exploring a simple and low-cost fabrication technique.
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影响因子：
6
作者：
Kim, W. J.;Lee, Y. G.;Park, Y. B.
通讯作者：
Park, Y. B.
影响因子：
5
作者：
Koch, CC;Morris, DG;Inoue, A
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Inoue, A
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4.7
作者：
Cruz-Gandarilla, Francisco;Maria Salcedo-Garrido, Ana;Mendoza-Leon, Hector
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Mendoza-Leon, Hector
影响因子：
6.2
作者：
Cizek, J.;Hausild, P.;Kim, H. S.
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Kim, H. S.
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8.4
作者：
Hosseini, M.;Pardis, N.;Kim, Dong-Ik
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Kim, Dong-Ik