Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating - Process and activation mechanism
Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating - Process and activation mechanism
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DOI：
10.1016/j.apsusc.2018.11.091
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发表时间：
2019-03-15
影响因子：
6.7
通讯作者：
Raciukaitis, Gediminas
中科院分区：
文献类型：
--
作者：
Ratautas, Karolis;Andrulevicius, Mindaugas;Raciukaitis, Gediminas
深入的实验分析结果的激光辅助局部铜沉积在商业聚酰胺6（PA 6）。验证了皮科和纳秒激光器用于聚合物的表面改性，然后进行银（I）活化，并在激光改性区域上通过自催化化学镀铜完成。对选择性金属电镀的起源进行了详细的研究，包括表面形貌和润湿性动力学，XPS分析和电阻测量。根据实验数据，提出了激光改性聚合物表面的活化机理。
Results of in-depth experimental analysis of the laser-assisted local copper deposition on commercial Polyamide 6 (PA 6) are presented. Pico- and nanosecond lasers were validated for surface modification of the polymer followed by silver (I) activation and finished by autocatalytic electroless copper plating on the laser-modified areas. Detailed investigations were dedicated to finding out the origin of selective metal plating, including the surface profiling and wettability dynamics, XPS analysis and electric resistance measurements of the deposited copper layer. Based on the experimental data, the mechanism of the polymer surface activation by the laser modification is proposed.