An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer
An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer
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使用镍中间层进行铝和镁扩散接合的研究
DOI：
10.1016/j.matlet.2012.06.014
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发表时间：
2012-09
影响因子：
3
通讯作者：
Lianmeng Zhang
中科院分区：
文献类型：
--
作者：
Jian Zhang;Guoqiang Luo;Yiyu Wang;Qiang Shen;Lianmeng Zhang
首次研究了用镍中间层扩散连接铝和镁的方法。键合试验是在440℃、1 Mpa、6×10−3PA真空条件下进行的。用扫描电子显微镜、电子探针、X射线衍射仪和维氏硬度计对界面进行了分析。结果表明，采用Ni中间层扩散连接可以成功连接异种金属，阻碍了镁铝金属间化合物的形成。从Al侧到Mg侧依次为Al基板、Al-Ni反应层、Ni中间层、Mg-Ni反应层、Mg基板。Al-Ni反应层和Mg-Ni反应层的显微硬度急剧增加，分别为201.5Hv和244.1Hv。断裂发生在Mg-Ni反应层的金属间化合物层中，Al和Mg表面均出现了Mg2Ni相。
Diffusion bonding aluminum and magnesium using a Ni interlayer was investigated for the first time. The bonding trials were carried out at 440°C for different time under 1MPa in a vacuum of 6×10−3Pa. The interfaces were investigated by means of SEM, EPMA, XRD and Vickers hardness test. The results showed that dissimilar metals of Mg/Al could be successfully joined by diffusion bonding with a Ni interlayer and the Mg–Al intermetallic compounds were impeded. From Al side to Mg side, there was Al substrate, Al–Ni reaction layer, Ni interlayer, Mg–Ni reaction layer, Mg substrate. The microhardness in the Al–Ni reaction layer and Mg–Ni reaction layer increased sharply, which were 201.5Hv and 244.1Hv. The fracture occurred in the intermetallic compound layer of the Mg–Ni reaction layer, where the Mg2Ni phase appeared on both Al and Mg surfaces.
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影响因子：
6.2
作者：
Li, Xianrong;Liang, Wei;Liu, Fencheng
通讯作者：
Liu, Fencheng
影响因子：
8.4
作者：
Kavian Omar Cooke;T. Khan;G. Oliver
通讯作者：
Kavian Omar Cooke;T. Khan;G. Oliver
影响因子：
4.7
作者：
Elthalabawy, Waled M.;Khan, Tahir I.
通讯作者：
Khan, Tahir I.
DOI：
10.1016/s1005-0302(11)60020-0
发表时间：
2011-01
期刊：
--
影响因子：
--
作者：
W. Elthalabawy;T. Khan
通讯作者：
W. Elthalabawy;T. Khan
影响因子：
4.4
作者：
B. Bokstein;S. Z. Bokstein;I. Spitsberg
通讯作者：
B. Bokstein;S. Z. Bokstein;I. Spitsberg