Innovation via Photosensitive Polyimide and Poly(benzoxazole) Precursors-a Review by Inventor
Innovation via Photosensitive Polyimide and Poly(benzoxazole) Precursors-a Review by Inventor
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光敏聚酰亚胺和聚苯并恶唑前体的创新——发明人的评论
DOI：
10.2494/photopolymer.17.685
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发表时间：
2004
影响因子：
0.8
通讯作者：
R. Rubner
中科院分区：
文献类型：
--
作者：
R. Rubner
本文回顾了作者作为电子工业化学家参与的两条创新道路，从最初的想法到商业化，再到在微电子和电子领域的应用。实施例涉及通过聚酰亚胺（负模式）和聚（苯并恶唑）（正模式）的光敏前体获得热稳定有机图案的方法。在直接光刻图案化后，前体层可以分别热转化为聚酰亚胺和聚（苯并恶唑）。光致抗蚀剂已经由许可的化学公司商业化。它们已经并且仍然主要应用于存储器和逻辑器件作为保护和缓冲涂层以减少由封装树脂引起的应力，并且应用于薄膜多芯片模块作为平坦化层间涂层。
In order to work out indispensable criteria for a promising process of innovation, a historical review is given for two paths of innovation, which the author was involved in as an chemist in electrical industry from the initial idea up to commercialization and application in the field of microelectronics and electronics. The examples concern the approach to thermally stable organic patterns via photosensitive precursors of polyimides (negative mode) and of poly(benzoxazoles) (positive mode). After direct photolithographic patterning the precursor layers can be thermally converted into polyimide and poly(benzoxazole), respectively. The photoresists have been commercialized by licensed chemical companies. They have been and still are mainly applied to memory and logic devices as protective and buffer coatings to reduce the stress caused by an encapsulating resin, and to thin film multichip modules as planarizing interlayer dielectrics.