Self-recoverable and mechanical-reinforced hydrogel based on hydrophobic interaction with self-healable and conductive properties

Self-recoverable and mechanical-reinforced hydrogel based on hydrophobic interaction with self-healable and conductive properties
复制标题

DOI:
10.1016/j.cej.2018.07.187
复制
发表时间:
2018-12-01
影响因子:
15.1
通讯作者:
Fu, Guodong
Fu, Guodong
中科院分区:
工程技术1区
文献类型:
--
作者:
Deng, Yuan;Hussain, Imtiaz;Fu, Guodong

文献摘要

被引文献

相似文献

开发可伸缩、坚韧、自修复的电子器件是人工智能仪器获得高机械性能、延长使用寿命的关键部件。然而,在不降低水凝胶材料的拉伸性和韧性的情况下提高其机械性能一直是一个困难的问题。在此,我们开发了高可拉伸和可恢复的聚(ε-己内酯)-聚(乙二醇)-聚(ε-己内酯)/聚(丙烯酸)基Ac-PCEC/PAA-Fe(III)水凝胶,具有自愈合,导电和增强的机械性能。力学性能分析表明,Ac-PCEC/PAA-Fe(III)水凝胶具有上级可恢复性、良好的延伸率(4592%)、较高的力学强度(0.38 MPa)和较高的压缩性能。同时,通过控制组分的比例,所开发的水凝胶被赋予可调的机械性能。此外,所设计的水凝胶还表现出自愈合和导电性能,由于动态相互作用(金属离子配位键和氢键)和导电性,分别。我们推测,机械增强,自我恢复,自我愈合和导电水凝胶可以用于大型可变形电子产品。
Developing ultrahigh stretchable, tough and self-healing electronic devices is the key component for the artificial intelligence apparatus which can produce high mechanical properties and prolong the service life. However, it has been a difficult issue to upsurge the mechanical property of hydrogel materials without declining their stretching, and toughness. Herein, we developed high stretchable and recoverable poly(e-caprolactone)-poly (ethylene glycol)-poly(e-caprolactone)/poly(acrylic acid) based Ac-PCEC/PAA-Fe(III) hydrogels with self-healable, conductive, and enhanced mechanical properties. Mechanical analysis indicates that Ac-PCEC/PAA-Fe(III) hydrogels have superior recoverable property, improved extensibility (4592 %), enhanced mechanical strength (0.38 MPa), and higher compressive performance. Simultaneously, the developed hydrogels are endowed with tunable mechanical properties by controlling the proportion of components. In addition, the designed hydrogels also exhibit self-healing and conductive properties due to the dynamic interactions (metal ions coordination bonds and hydrogen bonds) and conductivity, respectively. We hypothesize that the mechanical-reinforced, self-recoverable, self-healable and conductive hydrogels could be employed to large deformable electronics.