Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
复制标题
热对不同模模比 FOWLP 翘曲行为的综合研究
DOI：
10.1109/ectc32696.2021.00177
复制
发表时间：
2021
期刊：
影响因子：
--
通讯作者：
Debbie Claire Sanchez
中科院分区：
文献类型：
--
作者：
S. Chong;S. Lim;W. Seit;T. Chai;Debbie Claire Sanchez
加工扇出晶圆级封装的挑战之一是模制晶圆的翘曲。一些制造工艺如光刻、涂层、蚀刻和电镀无法处理高翘曲的晶圆。因此，模制的晶片应具有尽可能低的翘曲程度。在本文中，我们研究了具有不同模具比例的模制晶圆的翘曲行为。进一步的工作是评估翘曲度最高的晶圆在脱粘过程中不同卡盘温度的影响。脱粘工艺包括从金属载体上移除模制晶圆、从模制晶圆上移除热释放胶带以及对模制晶圆进行一系列热处理以减少模制晶圆的最终翘曲。
One of the challenges in processing Fan Out Wafer Level Package is the warpage of the Molded Wafer. Some of the fabrication processes such as lithography, coating, etching, and plating could not process wafer with high warpage. Therefore, the molded wafer should have as low a warpage magnitude as possible. In this paper, we study the warpage behavior of the molded wafer with different die to mold ratio. Further work is done on evaluating the impact of different chuck temperatures during the debonding process for the wafer with the highest warpage. The debonding process involved removing the molded wafer from the metal carriers, removing the thermal release tape from the molded wafer, and subjecting the molded wafer to series of thermal treatments to reduce the final warpage of the molded wafer.