Radiation Hardened FPGA Technology for Space Applications
Radiation Hardened FPGA Technology for Space Applications
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适用于太空应用的抗辐射 FPGA 技术
DOI：
10.1109/aero.2007.353098
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发表时间：
2007
期刊：
影响因子：
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通讯作者：
B. Cronquist
中科院分区：
文献类型：
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作者：
L. Rockett;Dinu Patel;Steven Danziger;J. J. Wang;B. Cronquist
高性能、高密度、抗辐射的现场可编程门阵列（fpga）在军事和空间应用中有很大的需求，以降低设计成本和周期时间。BAE系统公司在其位于弗吉尼亚州马纳萨斯的铸造厂实施了150nm抗辐射体CMOS工艺技术，以支持这种先进的产品需求。BAE系统公司和Actel公司正在合作将用于空间应用的下一代抗辐射FPGA产品推向市场。本文将描述rad hard AX-250 FPGA以及rad hard 150nm产品硬件、FPGA器件结构和防熔断阵列的电气和辐射测试数据，作为整个FPGA产品安装和鉴定工作的一部分。
High performance, high density, radiation hardened Field Programmable Gate Arrays (FPGAs) are in great demand for military and space applications to reduce design cost and cycle time. BAE Systems has implemented radiation hardened 150nm bulk CMOS process technology in its foundry located in Manassas, VA to support such advanced product needs. BAE Systems and Actel Corporation are collaborating to bring the next-generation radiation hardened FPGA product for space applications to market. This paper will describe the rad hard AX-250 FPGA and the electrical and radiation test data on rad hard 150nm product hardware, FPGA device structures and anti-fuse arrays, as part of the overall FPGA product installation and qualification effort.