Recrystallization and cube texture formation in heavily cold-rolled Ni7W alloy substrates for coated conductors
Recrystallization and cube texture formation in heavily cold-rolled Ni7W alloy substrates for coated conductors
复制标题
涂层导体用重冷轧 Ni7W 合金基体的再结晶和立方织构形成
DOI：
10.1557/jmr.2015.92
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发表时间：
2015-05
影响因子：
2.7
通讯作者：
Liu, Min
中科院分区：
文献类型：
--
作者：
Wang, Pan;Meng, Yichen;Ma, Lin;Liu, Min
研究了Ni 7 W合金在大变形量冷轧及不同温度退火后形变织构和再结晶织构的形成。冷轧到4.17的von Mises应变产生了位于经典黄铜型和铜型轧制织构之间的轧制织构的混合，S（{123}<634>）、黄铜（{110}<112>）和铜（{112}<111>）取向的分数分别为33%、28%和13%。变形后Ni 7 W合金的轧制织构在回复过程中略有增加，在再结晶过程中被大量消耗，在800 °C退火1 h后下降到22%。Ni <100>7 W合金在初次再结晶后，立方（{001}）取向的比例增加到26%，而其它随机取向的比例为43%。进一步退火促进立方晶粒生长，这导致立方织构的显著强化和大角度晶界（HAB）的显著损失。在1200 °C下退火1h后，Ni 7 W合金基体的立方织构和HAB分数分别为92.1%和27.8%。
The formation of deformation and recrystallization textures has been investigated in a Ni7W alloy after heavy cold rolling and subsequent annealing at different temperatures. Cold rolling to a von Mises strain of 4.17 produced a mix of rolling texture that lies between classical brass- and copper-type rolling textures, with the fraction of S({123}<634>), brass({110}<112>), and copper({112}<111>) orientations being 33, 28, and 13%, respectively. The fraction of rolling texture for the deformed Ni7W alloy samples increased slightly during recovery, was then consumed significantly during recrystallization, and dropped to 22% after being annealed at 800 °C for 1 h. The fraction of cube({001}<100>) orientation increased to 26% after primary recrystallization, whereas other random orientations of 43% formed in the Ni7W alloy samples. Further annealing promoted cube grain growth, which lead to a significant strengthening of the cube texture and to a significant loss in high angle boundary (HAB). The fractions of cube texture and HAB of the Ni7W alloy substrate were 92.1 and 27.8%, respectively, after annealing at 1200 °C for 1 h.
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影响因子：
9.4
作者：
G. H. Zahid;Yan Huang;P. Prangnell
通讯作者：
G. H. Zahid;Yan Huang;P. Prangnell
影响因子：
1.7
作者：
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通讯作者：
A. Ijaduola;J. R. Thompson;A. Goyal;C. Thieme;K. Marken
影响因子：
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作者：
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通讯作者：
M. Gao;H. Suo;J. Grivel;Y. Zhao;P. Gao;M. Liu;L. Ma
DOI：
10.4028/www.scientific.net/msf.495-497.1213
发表时间：
2005-07
期刊：
Materials Science Forum
影响因子：
--
作者：
I. Gervasyeva;D. Rodionov;B. Sokolov;Yu. V. Khlebnikova
通讯作者：
I. Gervasyeva;D. Rodionov;B. Sokolov;Yu. V. Khlebnikova
影响因子：
3.6
作者：
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通讯作者：
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