Formation of closely packed Cu nanoparticle films by capillary immersion force for preparing low-resistivity Cu films at low temperature
Formation of closely packed Cu nanoparticle films by capillary immersion force for preparing low-resistivity Cu films at low temperature
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DOI：
10.1007/s11051-016-3648-y
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发表时间：
2016-11
影响因子：
2.5
通讯作者：
S. Yokoyama;K. Motomiya;Hideyuki Takahashi;K. Tohji
中科院分区：
文献类型：
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作者：
S. Yokoyama;K. Motomiya;Hideyuki Takahashi;K. Tohji
采用滴注法制备了紧密堆积的纳米铜薄膜。在油墨干燥过程中施加的毛细浸润力使铜纳米颗粒相互吸引，形成紧密堆积的铜纳米颗粒薄膜。薄膜的表观密度取决于油墨中溶剂的类型，因为毛细浸润力受溶剂的表面张力和纳米铜在溶剂中的分散性的影响。紧密堆积的颗粒结构有利于纳米铜颗粒在低温下的烧结，从而得到低阻的铜膜。随着所用纳米颗粒尺寸的减小，烧结也得到了加强。我们证明了采用平均直径为61.7 nm的铜纳米颗粒紧密堆积的颗粒结构在热处理后的电阻率(7.6xμΩ/cm)低于传统制备的铜纳米颗粒薄膜(162xμΩ/cm)。
Films made of closely packed Cu nanoparticles (NPs) were obtained by drop casting Cu NP inks. The capillary immersion force exerted during the drying of the inks caused the Cu NPs to attract each other, resulting in closely packed Cu NP films. The apparent density of the films was found to depend on the type of solvent in the ink because the capillary immersion force is affected by the solvent surface tension and dispersibility of Cu NPs in the solvent. The closely packed particulate structure facilitated the sintering of Cu NPs even at low temperature, leading to low-resistivity Cu films. The sintering was also enhanced with a decrease in the size of NPs used. We demonstrated that a closely packed particulate structure using Cu NPs with a mean diameter 61.7 nm showed lower resistivity (7.6 μΩ cm) than a traditionally made Cu NP film (162 μΩ cm) after heat treatment.