THE ROLE OF EXCISION REPAIR IN THE REMOVAL OF TRANSIENT BENZO[A]PYRENE-INDUCED DNA LESIONS IN CHINESE HAMSTER OVARY CELLS

THE ROLE OF EXCISION REPAIR IN THE REMOVAL OF TRANSIENT BENZO[A]PYRENE-INDUCED DNA LESIONS IN CHINESE HAMSTER OVARY CELLS
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DOI:
10.1016/0921-8777(90)90030-9
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发表时间:
1990-07-01
期刊:
MUTATION RESEARCH
影响因子:
--
通讯作者:
DOUGLAS, GR
DOUGLAS, GR
中科院分区:
其他
文献类型:
--
作者:
BLAKEY, DH;DOUGLAS, GR

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在中国仓鼠卵巢(CHO)细胞,苯并[a]芘诱导持久性和短暂性病变,检测碱性蔗糖梯度沉降分析(ASG网站)。短暂性病变在15分钟内消失,而持续性病变可在治疗后数小时内检测到。虽然持续的ASG网站被认为是通过切除修复修复,负责的过程中的短暂ASG网站的消失是未知的。为了确定切除修复对去除这些短暂损伤的贡献,在切除修复抑制剂araC和新生霉素存在下,用苯并[a]芘(B(a)P)处理CHO细胞。结果表明:(1)araC抑制持久性的而非暂时性的B(a)P诱导的ASG位点的去除;(2)新生霉素,DNA切除修复的切割步骤的推定抑制剂,减少了治疗后立即检测到的损伤的数量,表明这些损伤中的许多可能代表修复期间产生的单链不连续性;和(3)在新生霉素存在下检测到的损伤在治疗后迅速消失。基于这些结果,我们得出结论,B(a)P诱导的短暂ASG位点的修复过程以外的切除修复。
In Chinese hamster ovary (CHO) cells, benzo[a]pyrene induces both persistent and transient lesions that are detected by alkaline sucrose gradient sedimentation analysis (ASG sites). The transient lesions disappear within 15 min while the persistent lesions can be detected for several hours following treatment. Although the persistent ASG sites are believed to be repaired by excision repair, the process responsible for the disappearance of the transient ASG sites is unknown. To determine the contribution of excision repair to the removal of these transient lesions, CHO cells were treated with benzo[a]pyrene (B(a)P) in the presnece of the inhibitors of excision repair, araC and novobiocin. The results indicate that: (1) araC inhibits the removal of persistent, but not the transient B(a)P-induced ASG sites; (2) novobiocin, a putative inhibitor of the incision step of DNA excision repair, reduced the number of lesions detected immediately following treatment, indicating that many of these lesions may represent single-strand discontinuities generated during repair; and (3) the lesions detected in the presence of novobiocin disappear rapidly following treatment. Based on these results, we concluded that B(a)P-induced transient ASG sites are repaired by a process other than excision repair.