Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier
Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier
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DOI：
10.1016/j.cirp.2017.04.088
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发表时间：
2017
影响因子：
4.1
通讯作者：
N. Suzuki;Y. Hashimoto;H. Yasuda;S. Yamaki;Y. Mochizuki
中科院分区：
文献类型：
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作者：
N. Suzuki;Y. Hashimoto;H. Yasuda;S. Yamaki;Y. Mochizuki
