Wafer-level packaging based on uniquely orienting self-assembly (The DUO-SPASS processes)
Wafer-level packaging based on uniquely orienting self-assembly (The DUO-SPASS processes)
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DOI：
10.1109/jmems.2006.876790
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发表时间：
2006-06-01
影响因子：
2.7
通讯作者：
Bohringer, Karl F.
中科院分区：
文献类型：
--
作者：
Fang, Jiandong;Bohringer, Karl F.
提出了一种基于唯一定向自组装的微器件芯片晶圆级封装策略，该策略包括以下步骤：1)主体零件唯一面向面，并在单层中铺展；2)零件托盘排列到具有一系列受体部位的对准模板上；3)零件一对一地锚定到受体部位；4)每个被锚定的零件固定到唯一的面内取向。我们用两种不同的自组织并行装配(SPASS)工艺来演示所有这些步骤：半干式唯一定向工艺(Semi-Duo-Spass)和干式唯一定向工艺(Duo-Spass)。半干法工艺利用：1)搅拌的空气/水界面，使具有单一疏水表面的散装部件具有独特的面向面部的特性；2)疏水载体晶片，使部件在空气环境中堆放成托盘；3)轨道振动，驱动部件，直到它们固定到接收点；4)重力，使部件唯一对准。实验表明，2 mm的正方形硅部件被正确地注册在具有164个受体位置的4-in排列模板上，经过3分钟的轨道晃动，缺陷率接近1%。干燥过程利用：1)动态稳定性的不对称性，使面向人脸的大块部件在一个面上具有突出特征；2)轨道抖动以驱动部件，直到它们首先被锚定到感受器位置，然后通过两阶段形状识别以明确的面内方向固定。在我们的实验中，1 mm正方形的硅部件在10分钟内以类似于2%的缺陷率组装在两个4-in排列模板上，每个模板分别具有397和720个受体位点。
A wafer-level packaging strategy for micro device chips based on uniquely orienting self-assembly is presented with the following steps: 1) bulk parts are uniquely face-oriented and spread in a single layer; 2) parts are palletized onto an alignment template having an array of receptor sites; 3) parts are anchored one-to-one to the receptor sites; 4) each anchored part is fixed to a unique in-plane orientation. We demonstrate all of these steps with two different self-organizing parallel assembly (SPASS) processes: a semidry uniquely orienting process (semi-DUO-SPASS) and a dry uniquely orienting (DUO-SPASS) process. The semidry process exploits: 1) an agitated air/water interface to uniquely face-orient bulk parts having a single hydrophobic face; 2) a hydrophobic carrier wafer to palletize the parts in an air environment; 3) orbital shaking to drive the parts until they are anchored to receptor sites; 4) gravity to uniquely align the parts. Experiments show that 2-mm square silicon parts are correctly registered on a 4-in alignment template having 164 receptor sites with a defect rate of similar to 1% after 3 min orbital shaking. The dry process utilizes: 1) asymmetry in dynamic stability to uniquely face-orient bulk parts having protruding features on one face; 2) orbital shaking to drive the parts until they are first anchored to receptor sites and then fixed in well-defined in-plane orientations by two-stage shape recognition. In our experiments, 1-mm square silicon parts are assembled with a defect rate of similar to 2% in 10 min on each of two 4-in alignment templates having, respectively, 397 and 720 receptor sites.