Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN
Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN
复制标题
通过构建BN的分层有序三维互连网络来提高导热性的聚合物复合材料
DOI：
10.1021/acsami.7b02410
复制
发表时间：
2017-04-19
影响因子：
9.5
通讯作者：
Wong, Ching-Ping
中科院分区：
文献类型：
--
作者：
Hu, Jiantao;Huang, Yun;Wong, Ching-Ping
本文采用冰模板自组装和浸渍相结合的方法制备了环氧树脂/有序三维氮化硼(3D-BN)网络复合材料。在相对较低的载荷量(34%)下，聚合物复合材料的导热系数可达4.42Wm(-1)K-1，远高于随机分布复合材料(环氧/无规3D-BN复合材料为1.81Wm(-1)K-1，环氧树脂/无规BN复合材料为1.16Wm(-1)K-1)，并具有较高的玻璃化转变温度(178.9~229.2℃)和尺寸稳定性(22.7ppm/K)。我们将热导率的增加归因于独特的定向3D-BN热导网络，其中BN微片沿平面方向的高得多的热导率是最有用的。这项研究为导热聚合物复合材料作为下一代电子封装和3D集成电路的热界面材料铺平了道路。
In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composites through combination of ice-templating self-assembly and infiltration methods. The polymer composites possess much higher thermal conductivity up to 4.42 W m(-1) K-1 at relatively low loading 34 vol % than that of random distribution composites (1.81 W m(-1) K-1 for epoxy/random 3D-BN composites, 1.16 W m(-1) K-1 for epoxy/random BN composites) and exhibit a high glass transition temperature (178.9-229.2 degrees C) and dimensional stability (22.7 ppm/K). We attribute the increased thermal conductivity to the unique oriented 3D-BN thermally conducive network, in which the much higher thermal conductivity along the in-plane direction of BN microplatelets is most useful. This study paves the way for thermally conductive polymer composites used as thermal interface materials for next generation electronic packaging and 3D integration circuits.