Pore formation in silicon by wet etching using micrometre-sized metal particles as catalysts
Pore formation in silicon by wet etching using micrometre-sized metal particles as catalysts
复制标题
DOI：
10.1039/b715639a
复制
发表时间：
2008-01-01
影响因子：
--
通讯作者：
Matsumura, Michio
中科院分区：
文献类型：
--
作者：
Lee, Chia-Lung;Tsujino, Kazuya;Matsumura, Michio
颗粒尺寸约为100 nm的Au、Pt或Ag颗粒。1mm的硅晶片作为催化剂，用于在含有氢氟酸和过氧化氢的水溶液中通过湿法蚀刻在p型Si（100）晶片中钻孔。以Pt颗粒为催化剂时，钻孔速度最快。然而，孔的侧壁和晶片的表面覆盖有约100微米的纳米多孔硅层。500 nm的厚度，和孔显示出锥形结构。当使用微米尺寸的Ag颗粒时，由于颗粒在溶液中不稳定，因此没有形成深孔。与Pt和Ag颗粒相反，Au颗粒在某些条件下钻直孔。然而，孔的形态取决于Au颗粒的形状。球形Au颗粒形成直孔，而非球形Au颗粒形成具有螺旋侧壁的孔。当Au颗粒形成由少量颗粒（< 10个颗粒）组成的聚集体时，倾向于形成弯曲孔。相反，当聚集体由大量颗粒组成时，形成直孔，并且钻孔速度比用孤立的Au颗粒形成的孔快。
Au, Pt, or Ag particles with particle sizes of ca. 1 mm were used as catalysts for boring pores in p-type Si( 100) wafers by wet etching in aqueous solutions containing hydrofluoric acid and hydrogen peroxide. Boring speed was fastest when Pt particles were used as the catalyst. However, the sidewalls of the pores and the surface of the wafer were covered with a nanoporous silicon layer of ca. 500 nm in thickness, and the pore showed a tapered structure. When micrometre-sized Ag particles were used, no deep pores were formed because the particles were unstable in the solution. In contrast to Pt and Ag particles, Au particles bored straight pores under some conditions. However, the morphology of pores depended on the shape of the Au particles. Spherical Au particles formed straight pores, whereas non-spherical Au particles formed pores with spiral sidewalls. When Au particles formed aggregates consisting of a small number of particles (< 10 particles), crooked pores tended to be formed. In contrast, when the aggregates were composed of a larger number of particles, straight pores were formed and the boring speed was faster than the pores formed with isolated Au particles.