Enhancement mechanism of ultrasonic vibration on interface bonding strength in laser joining of polymer to ceramic

Enhancement mechanism of ultrasonic vibration on interface bonding strength in laser joining of polymer to ceramic
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DOI:
10.1016/j.jmapro.2024.01.048
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发表时间:
2024-02
影响因子:
6.2
通讯作者:
Y.J. Chen;J.X. Tang;Z. Pang;C. Yuan;T.M. Yue
Y.J. Chen;J.X. Tang;Z. Pang;C. Yuan;T.M. Yue
中科院分区:
工程技术2区
文献类型:
--
作者:
Y.J. Chen;J.X. Tang;Z. Pang;C. Yuan;T.M. Yue

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