Gold electrodeposition for microelectronic, optoelectronic and microsystem applications
Gold electrodeposition for microelectronic, optoelectronic and microsystem applications
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DOI：
10.1007/bf03215566
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发表时间：
2007-01-01
期刊：
影响因子：
2.2
通讯作者：
Green, Todd A.
中科院分区：
文献类型：
--
作者：
Green, Todd A.
电沉积金是许多微电子、光电子和微系统器件制造中的关键技术。在这篇综述中，我们研究了一些最近的应用，并考虑各种镀金系统的设备制造的适用性。首先考虑氰化金和亚硫酸金镀液的性质及其局限性。随后分析了最新一代的非氰化物镀液，包括硫代硫酸盐、亚硫酸盐-硫代硫酸盐和铵金体系。还简要讨论了含巯基烷基磺酸和乙内酰脲配体的镀液。最后对镀金液的稳定性进行了分析。
The electrodeposition of gold is a key technology in the fabrication of many microelectronic, optoelectronic and microsystem devices. In this review, we examine some recent applications, and consider the suitability of various gold plating systems for device fabrication. The properties of gold cyanide and sulfite baths and their limitations are considered first. This is followed by an analysis of the latest generation of non-cyanide baths, including the thiosulfate, sulfite-thiosulfate and ammonium gold systems. Plating baths containing mercapto-alkylsulfonic acid and hydantoin ligands are also briefly discussed. Finally an analysis of the stability of gold plating baths is presented.