Full and partial genome-wide assembly and disassembly of the yeast transcription machinery in response to heat shock.
Full and partial genome-wide assembly and disassembly of the yeast transcription machinery in response to heat shock.
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DOI：
10.1101/gad.1437506
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发表时间：
2006-08
影响因子：
10.5
通讯作者：
Sara J. Zanton;B. Pugh
中科院分区：
文献类型：
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作者：
Sara J. Zanton;B. Pugh
真核基因受序列特异性DNA结合蛋白、染色质调节因子、一般转录因子和延伸因子控制。在这里，我们研究了这些群体的代表性成员的全基因组位置和它们的重新分配时，酿酒酵母基因组被热休克重编程。正如预期的那样，活性转录复合物的组装与H2A.Z核小体的驱逐偶联，并且解组装与核小体的返回偶联。值得注意的是，大量启动子组装成部分预起始复合物（部分PIC），其含有TFIIA、TFIID（和/或佐贺）、TFIIB、TFIIE和TFIIF。然而，RNA聚合酶II和TFIIH通常不被募集，并且核小体不被置换。这些启动子可能是为自然伴随热应激的额外应激做准备。例如，我们发现，氧化应激，这往往发生在细胞长时间暴露于高温下，将部分PIC转化为完整的PIC。因此，部分PIC代表了在染色质中间的启动子处组装的新的受调节的中间体。
Eukaryotic genes are controlled by sequence-specific DNA-binding proteins, chromatin regulators, general transcription factors, and elongation factors. Here we examine the genome-wide location of representative members of these groups and their redistribution when the Saccharomyces cerevisiae genome is reprogrammed by heat shock. As expected, assembly of active transcription complexes is coupled to eviction of H2A.Z nucleosomes, and disassembly is coupled to the return of nucleosomes. Remarkably, a large number of promoters assemble into partial preinitiation complexes (partial PICs), containing TFIIA, TFIID (and/or SAGA), TFIIB, TFIIE, and TFIIF. However, RNA polymerase II and TFIIH are generally not recruited, and nucleosomes are not displaced. These promoters may be preparing for additional stress that naturally accompany heat stress. For example, we find that oxidative stress, which often occurs with prolonged exposure of cells to high temperature, converts partial PICs into full PICs. Partial PICs therefore represent novel regulated intermediates that assemble at promoters in the midst of chromatin.