The effect of Ag and Cu underlayer on the L1
The effect of Ag and Cu underlayer on the L1
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DOI：
10.1016/j.apsusc.2004.03.217
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发表时间：
2004-06
影响因子：
6.7
通讯作者：
Xianhong Xu;H. Wu;Fusi Wang;Xiaohong Li
中科院分区：
文献类型：
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作者：
Xianhong Xu;H. Wu;Fusi Wang;Xiaohong Li
研究了FePt、FePt/Ag和FePt/Cu薄膜的磁性能和结构。在350°C退火1h后，FePt和FePt/Cu薄膜均为面心立方（FCC）无序结构，FePt/Ag薄膜具有较高的面内矫顽力（6236 Oe）。结果表明，Ag衬底能够降低FePt薄膜的有序化温度。在550°C下退火30 min后，FePt和FePt/Ag薄膜由于L10有序相的各向异性能高而成为硬磁薄膜，其磁电阻率在9- 10 kOe之间，而FePt/Cu薄膜的面内磁电阻率和垂直磁电阻率分别为2831和3565 Oe。这意味着铜底层不利于降低FePt薄膜的有序化温度。FePt/Ag薄膜的矫顽力几乎不随Ag衬底厚度的增加而变化，而FePt/Cu薄膜在Cu衬底厚度为20 nm时表现出最大的面内矫顽力（2831 Oe），在550°C退火温度下，Cu衬底厚度大于50 nm时表现出软磁特性。
The magnetic properties and structure of FePt, FePt/Ag and FePt/Cu thin films have been studied. After annealed at 350°C for 1h, the FePt and FePt/Cu films are FCC disordered, and FePt/Ag thin film has a high in-plane coercivity (6236Oe). It is indicated that Ag underlayer is able to reduce the ordering temperature of FePt films. After annealed at 550°C for 30min, FePt and FePt/Ag thin films become magnetically hard with coercivities in the range of 9–10kOe due to high anisotropy energy associated with the L10ordered phase, whereas the in-plane and perpendicular coercivities of FePt/Cu are only about 2831 and 3565Oe, respectively. It is implied that Cu underlayer is not advantageous in reducing the ordering temperature of FePt films. Note that the coercivity of FePt/Ag films hardly change with increasing Ag underlayer thickness, whereas the FePt/Cu film shows the maximum in-plane coercivity (2831Oe) at the Cu underlayer of 20nm, and behaves the soft magnetic properties when the thickness of Cu underlayer is lager than 50nm at annealing temperature of 550°C.